# US 9,434,817 B2 · Room-temperature-curable resin composition

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- Number: US 9,434,817 B2
- Document ID: US9434817B2
- Status: Granted
- Kind: B2
- Application number: 14/916,355
- Filed: 2014-07-10
- Published: 2016-07-07
- Granted: 2016-09-06
- Earliest claimed: 2013-10-10
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Taiki Katayama; Takafumi Sakamoto
- Web page: https://patentgrep.com/patent/US9434817B2

## CPC

- C08G 77/08: characterised by the catalysts used
- C07F 9/065: {Phosphoranes containing the structure P=N-}
- C07F 9/224: {Phosphorus triamides}
- C09D 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence)
- C09J 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09J183/10 takes precedence)
- C09K 3/1018: {Macromolecular compounds having one or more carbon-to-silicon linkages}
- C08G 77/50: by carbon linkages
- C08K 5/5435: containing oxygen in a ring
- C08K 5/5455: containing at least one [IMAGE cpc-sch-C08K-1012.gif] group
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C07F: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM (metal-containing porphyrins C07D487/22)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

The invention is a room-temperature-curable resin composition including a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1). This provides a room-temperature-curable resin composition which is curable in short time, free from generation of an odor due to the catalyst, free from a heavy environmental load; and has sufficient hardness, elongation at shear, and tensile strength after curing.

## Claims

### Claim 1

A room-temperature-curable resin composition comprising a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1),
wherein, “R” represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, “R1” and “R2” may be the same or different and represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, “A” represents a single bond or a divalent hydrocarbon group having 1 to 6 carbon atoms, “Y” represents a hydrolysable group, and “n” is an integer satisfying 0≦n≦3.

### Claim 2 (depends on 1)

The room-temperature-curable resin composition according to claim 1, wherein the composition comprises an organopolysiloxane.

### Claim 3 (depends on 2)

The room-temperature-curable resin composition according to claim 2, wherein the composition comprises:
(A) 0.001 to 20 parts by mass of the phosphazene skeleton-containing organosilicon compound shown by the foregoing general formula (1);
(B) 100 parts by mass of the organopolysiloxane;
(C) 0 to 15 parts by mass of a curing catalyst except for the component (A);
(D) 0 to 30 parts by mass of either or both of hydrolysable silane and a partial hydrolysis-condensate thereof except for the component (A);
(E) 0 to 1,000 parts by mass of a filler; and
(F) 0 to 30 parts by mass of an adhesion promoter.

### Claim 4 (depends on 1)

The room-temperature-curable resin composition according to claim 1, wherein the composition is used for any of a coating agent, an adhesive, and a sealant.

### Claim 5 (depends on 2)

The room-temperature-curable resin composition according to claim 2, wherein the composition is used for any of a coating agent, an adhesive, and a sealant.

### Claim 6 (depends on 3)

The room-temperature-curable resin composition according to claim 3, wherein the composition is used for any of a coating agent, an adhesive, and a sealant.