# US 9,434,816 B2 · Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer

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- Number: US 9,434,816 B2
- Document ID: US9434816B2
- Status: Granted
- Kind: B2
- Application number: 14/409,895
- Filed: 2012-06-25
- Published: 2015-10-22
- Granted: 2016-09-06
- Earliest claimed: 2012-06-25
- Assignees: Kolon Industries, Inc.
- Applicants: Hyo Jun Park; Hak Gee Jung
- Inventors: Hyo Jun Park; Hak Gee Jung
- Web page: https://patentgrep.com/patent/US9434816B2

## CPC

- C08G 73/14: Polyamide-imides
- C08G 73/1028: {characterised by the process itself, e.g. steps, continuous}
- C08G 73/1039: {comprising halogen-containing substituents}
- C08J 5/18: Manufacture of films or sheets
- C09D 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08J 2379/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)

## Abstract

Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bis-trifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride) and a unit structure derived from TPC (Terephthaloyl chloride; 1,4-benzenedicarbonyl chloride) are copolymerized.

## Claims

### Claim 1

A polyamide-imide copolymer film, comprising a copolymer resin which is obtained by copolymerizing a unit structure derived from (2,2′-bis-trifluoromethyl-4,4′-biphenyl diamine (TFDB), a unit structure derived from (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride (6FDA) and a unit structure derived from terephthaloyl chloride (TPC),
wherein the copolymer resin contains the unit structure derived from TFDB, the unit structure derived from 6FDA, and the unit structure derived from TPC in a molar ratio of 1:0.2-0.8:0.8-0.2.

### Claim 2 (depends on 1)

The polyamide-imide copolymer film of claim 1, wherein the copolymer resin is a copolymer resin in which the unit structure derived from TFDB, the unit structure derived from 6FDA and the unit structure derived from TPC are copolymerized in a molar ratio of 1:0.3-0.7:0.7-0.3.

### Claim 3 (depends on 1)

The polyamide-imide copolymer film of claim 1, wherein the copolymer resin has a weight average molecular weight of 10,000-400,000.

### Claim 4

A method of preparing a polyamide-imide copolymer, comprising the step of:
solution-reacting 2,2′-bis-trifluoromethyl-4,4′-biphenyl diamine (TFDB) with 4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride (6FDA) to prepare a first polymer, and then solution-reacting the first polymer with terephthaloyl chloride (TPC) to prepare polyamic acid; and
imidizing the polyamic acid in the presence of an imidization catalyst,
wherein the copolymer resin is a copolymer resin in which the unit structure derived from TFDB, the unit structure derived from 6FDA, and the unit structure derived from TPC are copolymerized in a molar ratio of 1:0.2-0.8:0.8-0.2.

### Claim 5 (depends on 4)

The method of claim 4, wherein, in the step of preparing the polyamic acid, the solution-reaction of TFDB with 6FDA is conducted such that a molar ratio of FTDB: 6FDA is 100 mol %: X mol %, and the solution-reaction of the first polymer with TPC is conducted such that a molar ratio of the first polymer: TPC is 100 mol %: 100−X mol %, wherein X is 20-80.