# US 9,434,642 B2 · Mechanically flexible and durable substrates

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- Number: US 9,434,642 B2
- Document ID: US9434642B2
- Status: Granted
- Kind: B2
- Application number: 11/804,865
- Filed: 2007-05-21
- Published: 2008-11-27
- Granted: 2016-09-06
- Earliest claimed: 2007-05-21
- Assignees: Corning Incorporated
- Applicants: Sean Matthew Garner; Gregory Scott Glaesemann; James Joseph Price
- Inventors: Sean Matthew Garner; Gregory Scott Glaesemann; James Joseph Price
- Web page: https://patentgrep.com/patent/US9434642B2

## CPC

- H10K 77/111: {Flexible substrates}
- C03C 4/00: Compositions for glass with special properties
- C03C 17/34: with at least two coatings having different compositions (C03C17/44 takes precedence)
- H10F 77/1698: {the metallic or insulating substrates being flexible}
- H10K 2102/311: {Flexible OLED}
- Y02E 10/549: Organic PV cells
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

## Claims

### Claim 1

A substrate comprising an alkali-free amorphous inorganic composition, wherein the substrate has a thickness of from about 1 μm to less than about 250 μm and at least one of:
a) a brittleness ratio of less than about 9.5 (μm)−1/2, or
b) a fracture toughness of at least about 0.75 MPa·(m)1/2 and wherein the substrate has a bend radius of less than about 30 cm.

### Claim 2 (depends on 1)

The substrate of claim 1, wherein the substrate has a brittleness ratio of less than about 8 (μm)−1/2.

### Claim 3 (depends on 1)

The substrate of claim 1, wherein the substrate has a fracture toughness of at least about 0.9 MPa·(m)1/2.

### Claim 4 (depends on 1)

The substrate of claim 1, wherein the substrate has at least one of:
a) a brittleness ratio of from about 0.1 (μm)−1/2 to less than about 9.5 (μm)−1/2, or
b) a fracture toughness of from about 0.75 MPa·(m)1/2 to about 10 MPa·(m)1/2.

### Claim 5 (depends on 1)

The substrate of claim 1, wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2.0 GPa·cm.

### Claim 6 (depends on 5)

The substrate of claim 5, wherein the product of the substrate modulus and the substrate thickness is less than about 1.0 GPa·cm.

### Claim 7 (depends on 1)

The substrate of claim 1, wherein the substrate has both a brittleness ratio of less than about 9.5 (μm)−1/2 and a fracture toughness of at least about 0.75 MPa·(m)1/2.

### Claim 8 (depends on 1)

The substrate of claim 1, wherein the substrate has both a brittleness ratio of less than about 9.5 (μm)−1/2 and a fracture toughness of at least about 0.75 MPa·(m)1/2; wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2 GPa·cm.

### Claim 9 (depends on 1)

The substrate of claim 1, wherein the substrate has both a brittleness ratio of less than about 8.0 (μm)−1/2 and a fracture toughness of at least about 0.9 MPa·(m)1/2; wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2 GPa·cm.

### Claim 10 (depends on 1)

The substrate of claim 1, wherein the substrate has a fatigue value, n, greater than about 29.

### Claim 11 (depends on 1)

The substrate of claim 1, wherein the substrate has a fatigue value, n, greater than about 38.

### Claim 12 (depends on 1)

The substrate of claim 1, wherein the composition comprises a glass, a glass-ceramic, or a combination thereof.

### Claim 13 (depends on 1)

The substrate claim 1, wherein the substrate has a bend radius of less than about 2 cm.

### Claim 14 (depends on 1)

The substrate of claim 1, further comprising a coating positioned on at least a portion of at least one surface of the substrate.

### Claim 15 (depends on 1)

The substrate of claim 1, wherein the substrate is fusion- drawn.

### Claim 16 (depends on 1)

The substrate of claim 1, wherein the substrate is a borosilicate glass.

### Claim 17 (depends on 16)

The substrate of claim 16, wherein the borosilicate glass is an alumino-borosilicate glass.

### Claim 18

An electric device comprising a flexible substrate comprising an alkali-free amorphous inorganic composition, wherein the substrate has a thickness of from about 1 μm to less than about 250 μm and at least one of:
a) a brittleness ratio of less than about 9.5 (μm)−1/2, or
b) a fracture toughness of at least about 0.75 MPa·(m)1/2 and wherein the substrate has a bend radius of less than about 30 cm.

### Claim 19 (depends on 18)

The electronic device of claim 18, wherein the substrate has a modulus; and wherein the product of the substrate modulus and the substrate thickness is less than about 2.0 GPa·cm.

### Claim 20 (depends on 18)

The electronic device of claim 18, wherein the electronic device comprises a light emitting display.

### Claim 21 (depends on 18)

The electronic device of claim 18, wherein the electronic device comprises an organic light emitting display device.

### Claim 22 (depends on 18)

The electronic device of claim 18, wherein the device is a display device.