# US 9,434,146 B2 · Using imprinted particle structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,434,146 B2 - Document ID: US9434146B2 - Status: Granted - Kind: B2 - Application number: 14/526,691 - Filed: 2014-10-29 - Published: 2016-05-05 - Granted: 2016-09-06 - Earliest claimed: 2014-10-29 - Assignees: Eastman Kodak Company - Applicants: Eastman Kodak Company - Inventors: Ronald Steven Cok; Mitchell Stewart Burberry - Web page: https://patentgrep.com/patent/US9434146B2 ## CPC - B32B 37/14: characterised by the properties of the layers - A01N 25/34: Shaped forms, e.g. sheets, not provided for in any other sub-group of this main group - B32B 37/06: characterised by the heating method - B32B 38/10: Removing layers, or parts of layers, mechanically or chemically - B32B 38/162: {Cleaning} - C09K 13/00: Etching, surface-brightening or pickling compositions (for glass C03C15/00, {C03C25/66; for mortars, concrete, artificial or natural stone or ceramics C04B41/5338}; for metallic material C23F, C23G1/00, C25F1/00; {for semi-conductors H10P52/40}) - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - A01N 25/10: Macromolecular compounds - B32B 38/06: Embossing - B32B 2305/72: Cured, e.g. vulcanised, cross-linked - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - A01N: PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF (preservation of food or foodstuff A23); BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES (preparations for medical, dental or toiletry purposes which kill or prevent the growth or proliferation of unwanted organisms A61K); PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure having a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer on or over the support and a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer. The multi-layer biocidal structure is located on a surface. ## Claims ### Claim 1 A method of using a multi-layer biocidal structure, comprising: providing a multi-layer biocidal structure that includes a support and a structured bi-layer on the support, the structured bi-layer including a first cured layer on the support, an exposed second layer on and in continuous contact with the first cured layer on a side of the first cured layer opposite the support that completely covers the first cured layer, the structured bi-layer including indentations having at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer; and providing the multi-layer biocidal structure on a surface. ### Claim 2 (depends on 1) The method of claim 1, further including providing another second layer over the support. ### Claim 3 A method of using a multi-layer biocidal structure, comprising: providing a multi-layer biocidal structure that includes a support and a structured bi-layer on or over the support, the structured bi-layer including a first cured layer on or over the support, a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support, the structured bi-layer having at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer; providing the multi-layer biocidal structure on a surface; and removing at least a portion of the second layer and locating another second layer over the remaining multi-layer biocidal structure. ### Claim 4 (depends on 1) The method of claim 1, further including replacing the multi-layer biocidal structure on the surface. ### Claim 5 (depends on 1) The method of claim 1, further including processing the multi-layer biocidal structure on the surface. ### Claim 6 (depends on 5) The method of claim 5, further including cleaning the multi-layer biocidal structure. ### Claim 7 (depends on 6) The method of claim 6, wherein cleaning the multi-layer biocidal structure includes abrading the second cured layer. ### Claim 8 (depends on 7) The method of claim 7, wherein abrading the second cured layer includes removing at least some particles from the second cured layer. ### Claim 9 (depends on 8) The method of claim 8, wherein abrading the second cured layer includes exposing other particles in the second cured layer. ### Claim 10 (depends on 6) The method of claim 6, wherein cleaning the multi-layer biocidal structure includes chemically processing the second cured layer. ### Claim 11 (depends on 10) The method of claim 10, wherein chemically processing the particles includes improving the biocidal efficacy of the particles. ### Claim 12 (depends on 10) The method of claim 10, wherein chemically processing the particles includes reducing the biocidal efficacy of the particles. ### Claim 13 (depends on 1) The method of claim 1, further including mechanically peeling the first and second cured layers. ### Claim 14 (depends on 1) The method of claim 1, further including chemically removing the first cured layer and second layer. ### Claim 15 (depends on 1) The method of claim 1, further including heating the first cured layer and second layer to remove them from the support. ### Claim 16 (depends on 1) The method of claim 1, further including heating the multi-layer biocidal structure to remove it from the surface. ### Claim 17 (depends on 1) The method of claim 1, further including removing a portion of the second layer to expose at least a portion of the surface of at least one of the particles. ### Claim 18 A method of using a multi-layer biocidal structure, comprising: providing a multi-layer biocidal structure that includes a support and a structured bi-layer on or over the support, the structured bi-layer including a first cured layer on or over the support, a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support, the structured bi-layer having at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer; providing the multi-layer biocidal structure on a surface; and etching, plasma etching, reactive plasma etching, ion etching, or sandblasting the first cured layer or the second layer. ### Claim 19 (depends on 1) The method of claim 1, further including locating another second layer over the surface.