# US 9,434,045 B2 · Planarization device and planarization method using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,434,045 B2 - Document ID: US9434045B2 - Status: Granted - Kind: B2 - Application number: 14/269,370 - Filed: 2014-05-05 - Published: 2015-11-05 - Granted: 2016-09-06 - Earliest claimed: 2014-05-05 - Assignees: Macronix International Co., Ltd. - Applicants: Macronix International Co., Ltd. - Inventors: Yu-Hua Yeh; Liang-Yu Hu; Tang-Tsai Chang; Ming-Tsan Lai - Web page: https://patentgrep.com/patent/US9434045B2 ## CPC - B24B 37/04: designed for working plane surfaces - B24B 37/042: {operating processes therefor} - B24B 37/105: {the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement} - B24B 37/34: Accessories - B24B 55/00: Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition (of general applicability for machine tools B23Q11/00; in general F16P) - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm. ## Claims ### Claim 1 A planarization device, comprising: a platen; a grinding pad disposed on the platen; an operation arm having a lower surface; a chuck rotatably disposed on the operation arm; and a first shielding pad detachably disposed on the lower surface of the operation arm; wherein a thickness of the first shielding pad is larger than a gap between the operation arm and the chuck, and wherein the first shielding pad extends below an upper surface of the chuck. ### Claim 2 (depends on 1) The planarization device according to claim 1, wherein the first shielding pad is extended within the gap. ### Claim 3 (depends on 1) The planarization device according to claim 1, wherein the first shielding pad has a notch, and an inner diameter of the notch is larger than an outer diameter of the chuck. ### Claim 4 (depends on 1) The planarization device according to claim 1, wherein the first shielding pad has a notch, and an inner diameter of the notch is less than an outer diameter of the chuck. ### Claim 5 (depends on 1) The planarization device according to claim 1 wherein the first shielding pad has a notch, and a bottom surface of the notch is separated from a lateral surface of the chuck by an interval. ### Claim 6 (depends on 1) The planarization device according to claim 1, wherein the first shielding pad has a notch, and the planarization device further comprises: a second shielding pad disposed between the operation arm and the chuck and located within the notch of the first shielding pad. ### Claim 7 (depends on 1) The planarization device according to claim 1, wherein further comprises: a locking component fixing a relative position between the first shielding pad and the operation arm. ### Claim 8 (depends on 7) The planarization device according to claim 7, wherein the first shielding pad has a recess and a through hole, the through hole penetrates the first shielding pad from a bottom surface of the recess, the locking component passes through the through hole to fix the first shielding pad to the operation arm, and an end of the locking component is received within the recess. ### Claim 9 (depends on 1) A planarization method for semiconductor structure, comprising: providing a planarization device according to claim 1; providing a semiconductor structure, wherein the semiconductor structure comprises a substrate and a layer structure formed on the substrate; the chuck picking up the semiconductor structure; and the chuck driving the layer structure of the semiconductor structure to rotate and touch the grinding pad for planarizing the layer structure. ### Claim 10 (depends on 9) The planarization method according to claim 9, wherein the first shielding pad is extended within the gap. ### Claim 11 (depends on 9) The planarization method according to claim 9, wherein the first shielding pad has a notch, and an inner diameter of the notch is larger than an outer diameter of the chuck. ### Claim 12 (depends on 9) The planarization method according to claim 9, wherein the first shielding pad has a notch, and an inner diameter of the notch is less than an outer diameter of the chuck. ### Claim 13 (depends on 9) The planarization method according to claim 9 wherein the first shielding pad has a notch, and a bottom surface of the notch is separated from a lateral surface of the chuck by an interval. ### Claim 14 (depends on 9) The planarization method according to claim 9, wherein the first shielding pad has a notch, and the planarization device further comprises: a second shielding pad disposed between the operation arm and the chuck and located within the notch of the first shielding pad. ### Claim 15 (depends on 9) The planarization method according to claim 9, wherein the planarization device further comprises: a locking component fixing a relative position between the first shielding pad and the operation arm. ### Claim 16 (depends on 15) The planarization method according to claim 15, wherein the first shielding pad has a recess and a through hole, the through hole penetrates the first shielding pad from a bottom surface of the recess, the locking component pass through the through hole to fix the first shielding pad to the operation arm, and an end of the locking component is received within the recess.