# US 9,434,027 B2 · Bonding wire and method for manufacturing same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,434,027 B2
- Document ID: US9434027B2
- Status: Granted
- Kind: B2
- Application number: 14/335,225
- Filed: 2014-07-18
- Published: 2014-11-06
- Granted: 2016-09-06
- Earliest claimed: 2012-01-25
- Assignees: Nippon Micrometal Corporation
- Applicants: Nippon Micrometal Corporation
- Inventors: Ryo Togashi
- Web page: https://patentgrep.com/patent/US9434027B2

## CPC

- B23K 35/0227: {Rods or wires (B23K35/0244 takes precedence)}
- B21C 1/02: Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
- B21C 9/00: Cooling, heating or lubricating drawing material (B21C3/14 takes precedence)
- B21C 37/042: {Manufacture of coated wire or rods}
- B23K 35/22: characterised by the composition or nature of the material
- B23K 35/302: {Cu as the principal constituent}
- B23K 35/404: {Coated rods; Coated electrodes}
- B32B 15/018: {one layer being formed of a noble metal or a noble metal alloy}
- C22C 9/00: Alloys based on copper
- C22F 1/00: Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24)
- C22F 1/08: of copper or alloys based thereon
- H10W 72/0115: {Apparatus for manufacturing bond wires}
- B22D 11/041: for vertical casting (B22D11/043, B22D11/049 - B22D11/059 take precedence)
- H10W 72/0116: {Apparatus for manufacturing strap connectors}
- H10W 72/015: {of bond wires}
- H10W 72/01515: {Forming coatings}
- H10W 72/01551: {Changing the shapes of bond wires}
- H10W 72/01565: {Thermally treating}
- H10W 72/522: {Multilayered bond wires, e.g. having a coating concentric around a core}
- H10W 72/523: {characterised by the structures of the outermost layers, e.g. multilayered coatings}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/555: {of outermost layers of multilayered bond wires, e.g. material of a coating}
- Y10T 29/49988: Metal casting
- Y10T 428/12222: Shaped configuration for melting [e.g., package, etc.]
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B21C: MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- C22F: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass, C23F17/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B22D: CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES (shaping of plastics or substances in a plastic state B29C; metallurgical processing, selection of substances to be added to metal C21, C22)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.

## Claims

### Claim 1

A bonding wire comprising:
a core member mainly composed of copper; and
a palladium coating layer, wherein
said core member includes a fibrous structure with copper crystals extending in an axial direction, said fibrous structure being formed in a center of said core member, and
said core member includes a grain-shaped recrystallized region formed through a recrystallization of crystals, said grain-shaped recrystallized region being formed surrounding said fibrous structure.

### Claim 2 (depends on 1)

The bonding wire according to claim 1, further including a gold coating layer formed on said palladium coating layer.

### Claim 3 (depends on 1)

The bonding wire according to claim 1, wherein said fibrous structure exists in said core member in an amount of 0.5 to 90% by mass.

### Claim 4 (depends on 2)

The bonding wire according to claim 2, wherein said fibrous structure exists in said core member in an amount of 0.5 to 90% by mass.

### Claim 5 (depends on 1)

The bonding wire according to claim 1, wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.

### Claim 6 (depends on 2)

The bonding wire according to claim 2, wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.

### Claim 7 (depends on 3)

The bonding wire according to claim 3, wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.

### Claim 8 (depends on 4)

The bonding wire according to claim 4, wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.