# US 9,433,962 B2 · Application of fluids to substrates

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- Number: US 9,433,962 B2
- Document ID: US9433962B2
- Status: Granted
- Kind: B2
- Application number: 14/978,507
- Filed: 2015-12-22
- Published: 2016-04-21
- Granted: 2016-09-06
- Earliest claimed: 2013-05-10
- Assignees: Infineon Technologies AG
- Applicants: Infineon Technologies AG
- Inventors: Karl Pilch; Hans Leitner; Michael Kalin
- Web page: https://patentgrep.com/patent/US9433962B2

## CPC

- B05B 12/02: for controlling time, or sequence, of delivery
- B05B 13/02: Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work (B05B13/06 takes precedence)
- B05C 11/02: Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface {; Controlling means therefor}(B05C7/00 takes precedence; Hand tools for such purposes B05C17/10); Control of the thickness of a coating {by spreading or distributing liquids or other fluent materials already applied to the coated surface}(controlling supply of liquid or other fluent material B05C11/10)
- B05D 1/002: {the substrate being rotated}
- B05D 3/007: {After-treatment}
- H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
- H10P 72/0434: {mainly by convection}
- H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like}
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D)
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

## Claims

### Claim 1

An apparatus comprising:
a first device comprising:
a substrate holder;
a glue application device configured to apply a glue to one of a semiconductor substrate or a carrier on the substrate holder;
a heating mechanism configured to locally heat the glue; and
a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile having a flatness with a predetermined tolerance of the glue on the one of the semiconductor substrate or the carrier; and
a second device comprising a grinding wheel configured to grind the semiconductor substrate mounted to the carrier with the glue sandwiched between the semiconductor substrate and the carrier.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein a viscosity of the glue is temperature-dependent.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the heating mechanism comprises an infrared lamp.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the substrate holder is rotatable.

### Claim 5 (depends on 4)

The apparatus of claim 4, wherein the glue application device is configured to apply the glue while the substrate holder rotates.

### Claim 6 (depends on 4)

The apparatus of claim 4, wherein the controller is configured to control the heating mechanism to locally heat the glue while the substrate holder rotates.

### Claim 7 (depends on 1)

The apparatus of claim 1, further comprising a fluid thickness measurement device, the apparatus being further configured to determine a local heating pattern through a calibration measurement using the fluid thickness measurement device.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the substrate holder is configured to receive the semiconductor substrate.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein the local heating locally changes a behavior of the glue from an essentially non-Newtonian behavior to an essentially Newtonian behavior.

### Claim 10 (depends on 7)

The apparatus of claim 7, wherein the heating mechanism is configured to apply the heating based on the local heating pattern.

### Claim 11 (depends on 10)

The apparatus of claim 10, wherein the local heating pattern is a spatial heat pattern to be applied across the one of the semiconductor substrate or carrier.