Connecting structure of cooling device, cooling device, and method for connecting cooling device

An electronic device using a cooling device, comprising:

• a substrate;
• a heating element mounted on the substrate;
• a heat receiving unit for storing a refrigerant and receiving the heat from the heating element;
• a connecting board with an opening;
• a pressing plate of thin plate elastically deformable;
• a first fixing unit for fixing the pressing plate to the connecting board with the pressing plate disposed covering the heat receiving unit;
• a second fixing unit for fixing the connecting board to the substrate with the heating element and the heat receiving unit disposed in the opening;
• a heat radiating unit for radiating heat by condensing and liquefying a vapor-state refrigerant vaporized in the heat receiving unit;
• and
• a pipe connecting the heat radiating unit to the heat receiving unit,
• wherein the first fixing unit fixes the pressing plate to the connecting board with the heat receiving unit abutting firmly against the heating element, and
• the second fixing unit fixes the connecting board to the substrate with the heat receiving unit abutting firmly against the heating element.

A method for connecting a cooling device, comprising:

• forming a connecting board with an opening;
• disposing a heat receiving unit that composing a cooling device in the opening;
• disposing a pressing plate of thin plate elastically deformable so as to cover the heat receiving unit;
• connecting the pressing plate to the connecting board;
• disposing the connecting board on a substrate on which a heating element is mounted so that the heating element may be housed in the opening;
• disposing, on the connecting board, a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant vaporized in the heat receiving unit;
• and
• connecting the heat radiating unit to the heat receiving unit by a pipe.