Method of manufacturing a multichip package structure

A method of manufacturing a multichip package structure, comprising the steps of:

• providing a substrate body;
• placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body;
• surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips;
• forming a semidrying surrounding light-reflecting frame by naturally drying the surrounding liquid colloid at a predetermined room temperature between 20° C.-30° C. until the surrounding liquid colloid forms a dried colloid outer layer and a non-drying colloid body without using any curing device, the dried colloid outer layer covering the non-drying colloid body, and the dried colloid outer layer and the non-drying colloid body to form the semidrying surrounding light-reflecting frame;
• forming a package colloid body on the substrate body to cover the light-emitting chips while the non-drying colloid body of the semidrying surrounding light-reflecting frame is further naturally dried at the predetermined room temperature between 20° C.-30° C., wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body;
• and
• after forming a package colloid body on the substrate body to cover the light-emitting chips, the non-drying colloid body of the semidrying surrounding light-reflecting frame is further naturally dried at the predetermined room temperature between 20° C.-30° C. until completely dried, and thus the semidrying surrounding light-reflecting frame becomes a dried surrounding light-reflecting frame, the dried surrounding light-reflecting frame being in a solid state;
• wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface of the semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.