Wiring board, semiconductor device and method for manufacturing wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorSatoshi Fujii
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Abstract
A wiring board includes a resin substrate in which reinforcement members are arranged horizontally, a through electrode filled in a through hole penetrating the substrate in a thickness direction, and wiring layers respectively formed on both surfaces of the substrate and electrically connected to each other via the through electrode. The reinforcement members are arranged such that reinforcement members arranged in a middle region of the substrate in the thickness direction has higher density than reinforcement members arranged in the regions other than the middle region of the substrate.
Claims13
A wiring board comprising:
- a resin substrate in which a plurality of reinforcement members are arranged horizontally, wherein the resin substrate is free from a wiring layer;
- a through electrode filled in a through hole penetrating the substrate in the thickness direction;
- and
- wiring layers respectively formed on both surfaces of the substrate and electrically connected to each other via the through electrode, wherein the plurality of the reinforcement members are non-uniformly distributed in the thickness direction, with one or more of reinforcement members being densely distributed in a middle region of the substrate in the thickness direction and a remainder of the reinforcement members being sparsely distributed in near-surface regions of the substrate that are the regions other than the middle region of the substrate, wherein the reinforcement members in the middle region of the substrate in the thickness direction have a higher density than the reinforcement members in the near-surface regions of the substrate.
Dependencies are inferred from the claim text.