High strength through-substrate vias
AssigneeInvensas Corporation
InventorCyprian Emeka Uzoh
Life of this patent
Estimating the term…
Abstract
A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.
Claims19
A component, comprising:
- a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces, each conductive element containing an alloy of a metal material selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth, wherein the conductive elements are filled vias, and wherein at least one of the vias includes a concave face exposed at least one of the first and second surfaces of the support structure and defining a first cavity within a portion of the at least one of the vias that defines a second cavity with a second bonding metal mass disposed at least partially within the first cavity, wherein the first and second cavities are laterally offset from one another.
A component, comprising:
- a support structure having first and second spaced-apart and parallel surfaces and a plurality of metallic vias extending in a direction between the first and second surfaces, each via containing an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth, at least one via including a concave end surface exposed at at least one of the first and second surfaces of the support structure and defining a cavity within the via;
- wherein at least one of the vias includes a concave face exposed at least one of the first and second surfaces of the support structure and defining a first cavity within a portion of the at least one of the vias that defines a second cavity with a second bonding metal mass disposed at least partially within the first cavity, wherein the first and second cavities are laterally offset from one another;
- and
- a bonding metal mass disposed at least partially within the first cavity
- wherein the alloy has a first mechanical strength and the wiring metal material has a second mechanical strength, the first mechanical strength characteristic being greater than the second mechanical strength.
Dependencies are inferred from the claim text.