Layout method for printed circuit board and printed circuit board thereof
AssigneeEverDisplay Optronics (Shanghai) Limited
InventorDongfang Feng
Life of this patent
Estimating the term…
Abstract
A layout method for a printed circuit board, comprising: defining a layout area on the printed circuit board; disposing at least one padstack on the layout area; disposing a welding material area on the padstack to partially cover the padstack and be located at one end of the padstack; disposing a blocking area on the layout area, wherein the blocking area comprises an opening to expose the padstack; and forming a wiring, wherein the wiring is connected with the padstack and the welding material area through the opening without overlapping the blocking area. The layout method for a printed circuit board and the printed circuit board may avoid that the outlet of the wiring is formed through the side of the welding material area to leave a blank area on the padstack.
Claims12
A layout method for a printed circuit board, comprising:
- defining a layout area on the printed circuit board;
- disposing at least one padstack on the layout area;
- disposing a welding material area on the padstack to partially cover the padstack, be located at one end of the padstack, and leave a blank area on the padstack that is not covered by the welding material area, wherein the welding material area is an area for an element to be connected to contact with the padstack, and the element to be connected or a pin of the element to be connected is welded on the welding material area;
- disposing a blocking area on the layout area, wherein the blocking area comprises an opening to expose the padstack, and the blocking area encloses the padstack except on side of the padstack opposite to the welding material area;
- and
- forming a wiring, wherein the wiring is connected with the padstack and the welding material area through the opening without overlapping the blocking area, and the wiring overlaps, and connects with the blank area on the padstack that is not covered by the welding material area, so as to be connected with the welding material area.
A printed circuit board, comprising:
- a layout area;
- at least one padstack disposed on the layout area;
- a welding material area disposed on the padstack to partially cover the padstack, be located at one end of the padstack, and leave a blank area on the padstack that is not covered by the welding material area, wherein the welding material area is an area for an element to be connected to contact with the padstack, and the element to be connected or a pin of the element to be connected is welded on the welding material area;
- a blocking area disposed on the layout area, wherein the blocking area comprises an opening and the padstack is disposed therein, and the blocking area encloses the padstack except one side of the padstack opposite, to the welding material area;
- and
- a wiring connected with the padstack and the welding material area through the opening without overlapping the blocking area, wherein the wiring overlaps, and connects with the blank area on the padstack that is not covered by the welding material area, so as to be connected with the welding material area.
Dependencies are inferred from the claim text.