# US 9,433,076 B2 · Mounting structure of electronic components provided with heat sink

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- Number: US 9,433,076 B2
- Document ID: US9433076B2
- Status: Granted
- Kind: B2
- Application number: 14/618,284
- Filed: 2015-02-10
- Published: 2015-11-26
- Granted: 2016-08-30
- Earliest claimed: 2014-05-23
- Assignees: New Japan Radio Co., Ltd.
- Applicants: New Japan Radio Co., Ltd
- Inventors: Yoshio Fujii; Shinji Hara
- Web page: https://patentgrep.com/patent/US9433076B2

## CPC

- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting}
- H10W 40/10: Arrangements for heating
- H10W 70/68: Shapes or dispositions thereof
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 2201/09072: Hole or recess under component or special relationship between hole and component
- H10W 70/415: {Leadframe inner leads serving as die pads}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.

## Claims

### Claim 1

A mounting structure of electronic components provided with a heat sink, comprising:
a plurality of electronic components, each having lead portions and a resin-molded portion and being formed such that one side surface of the respective lead portions are substantially coplanar with one side surface of the resin-molded portion, so that the one side surface of the respective lead portions and the one side surface of the resin-molded portion form a back surface of the electronic component;
an electric circuit board to which the respective lead portions of each of the plurality of electronic components are connected;
a heat sink for releasing heat generated from the plurality of electronic components; and
a resin film disposed between the plurality of electronic components and the heat sink,
wherein each of the lead portions is connected to the electric circuit board at opposite surfaces to the one side surface thereof so that respective back surfaces of the plurality of electronic components are substantially coplanar with each other; and
the heat sink is provided on the back surfaces of the plurality of electronic components such that a single heat sink covers at least two of the plurality of electronic components.

### Claim 2 (depends on 1)

The mounting structure of electronic components provided with a heat sink of claim 1,
wherein the electronic components are formed as a one side resin-molded element where the resin-molded portion is formed from the back surface of the electronic component toward the opposite surface thereof so as to embed a circuit element, and the resin-molded portions are disposed in openings or recesses formed on the electric circuit board.

### Claim 3 (depends on 1)

The mounting structure of electronic components provided with a heat sink of claim 1,
wherein the heat sink is provided on the back surfaces of the plurality of electronic components through only the resin film.