Printed wiring boards having thermal management features and thermal management apparatuses comprising the same

A circuit board assembly comprising:

• a printed wiring board comprising an insulator substrate, an electrical conductor at least partially embedded within the insulator substrate, a second mounting region in electrical continuity with the electrical conductor, a first mounting region in electrical continuity with the electrical conductor, and a thermal conductor at least partially embedded within the insulator substrate and electrically isolated from the electrical conductor;
• a second component coupled to the second mounting region;
• and
• a first component coupled to the first mounting region,
• wherein the insulator substrate and the thermal conductor are arranged into:
• a targeted heat transfer region proximate to the second mounting region, wherein the targeted heat transfer region comprises an arrangement of the thermal conductor that completely surrounds the first component, and
• a bulk region at positions spaced apart from the second mounting region, wherein the bulk region comprises a lattice arrangement of the thermal conductor in thermal continuity with the thermal conductor of the targeted heat transfer region.

A heat transfer management apparatus comprising:

• a printed wiring board comprising an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate and electrically isolated from the electrical conductor;
• a first component coupled to the printed wiring board;
• a second component coupled to the printed wiring board and positioned distally from the first component,
• wherein the printed wiring board places the first component and the second component in thermal continuity with one another, and the thermal conductor and the insulator substrate are arranged into:
• a targeted heat transfer region proximate to the first component, wherein the targeted heat transfer region comprises an arrangement of the thermal conductor that completely surrounds the first component, and
• a bulk region proximate to the second component, wherein the bulk region comprises a lattice arrangement of the thermal conductor in thermal continuity with the thermal conductor of the targeted heat transfer region.