Image sensor chips

An image sensor chip comprising:

• a first wafer including an image sensor having a plurality of sub-pixels and a plurality of pixels, each pixel including at least one of the plurality of sub-pixels, each of the plurality of sub-pixels being configured to detect at least one photon, and to output a sub-pixel signal according to a result of the detection, the plurality of sub-pixels being grouped into first through n-th sub-pixel groups, each of the first through n-th sub-pixel groups including at least one of the plurality of sub-pixels, the first through n-th sub-pixel groups being grouped into first through m-th pixel groups, each of the first through m-th pixel groups including at least one of the first through n-th sub-pixel groups;
• and
• a second wafer including an image processor, the first wafer and the second wafer being in a wafer stack structure;
• the image processor being configured to
• process sub-pixel signals for each pixel to generate first through m-th pixel images, the first through m-th pixel images corresponding to the respective first through m-th pixel groups;
• perform scaling and registration on the first through m-th pixel images to generate a high-resolution image;
• scale the high-resolution image to a size of at least one of the first through m-th pixel images;
• compare the scaled high-resolution image with one of the first through m-th pixel images;
• and
• correct a reconstruction error based on the comparing.

An image sensor chip comprising:

• a first wafer including an image sensor having a plurality of sub-pixel groups of a sub-pixel array configured to generate sub-pixel signals;
• and
• a second wafer including an image processor configured to,
• generate a plurality of sub-pixel images of an object based on sub-pixel signals output from the plurality of sub-pixel groups of the sub-pixel array,
• generate angular information associated with at least a first portion of the object based on a comparison between at least two of the plurality of sub-pixel images,
• generate depth data associated with at least the first portion of the object based on the angular information,
• generate a resultant image based on the plurality of sub-pixel images using the angular information and the depth data,
• scale and register the resultant image to generate a high-resolution image,
• scale the high-resolution image to a size of at least one of the plurality of sub-pixel images,
• compare the scaled high-resolution image with one of the plurality of sub-pixel images, and
• correct a reconstruction error based on the comparing;
• wherein the first wafer and the second wafer are formed in a wafer stack structure.