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US 9,431,993 B1Granted
Temperature compensated resonator with a pair of spaced apart internal dielectric layers
AssigneeMicrel, Inc.
InventorsWan-Thai Hsu, John Ryan Clark
Life of this patent
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Abstract
A device includes a substrate, an electrode supported by the substrate, an anchor supported by the substrate, and a composite structure supported by the anchor, disposed adjacent the electrode, and configured for resonant vibration. The composite structure includes an external layer and an internal dielectric region covered by the external layer.
Claims25
A device comprising:
- a substrate;
- an electrode supported by the substrate;
- an anchor supported by the substrate;
- and
- a composite structure supported by the anchor, disposed adjacent the electrode, and configured for resonant vibration;
- wherein the composite structure comprises a pair of external conductive layers, a central conductive layer, and a pair of internal dielectric layers arranged in a stacked configuration in which:
- each internal dielectric layer is disposed inward of, and in contact with, a respective one of the external conductive layers;
- the pair of internal dielectric layers are spaced apart from one another in a direction of the resonant vibration by the central conductive layer;
- each internal dielectric layer of the pair of internal dielectric layers is in contact with central conductive layer;
- and
- each internal dielectric layer is offset from a center of the composite structure in the direction of the resonant vibration.
8 more elements
A micromechanical device comprising:
- a substrate;
- an electrode supported by the substrate;
- an anchor supported by the substrate;
- and
- a composite structure supported by the anchor, disposed adjacent the electrode, and configured for resonant vibration;
- wherein the composite structure comprises a pair of external polysilicon layers, a central polysilicon layer, and a pair of internal dielectric layers arranged in a stacked configuration in which:
- the pair of internal dielectric layers are spaced apart from one another in a direction of the resonant vibration by the central polysilicon layer;
- each internal dielectric layer is disposed inward of, and in contact with, a respective one of the external polysilicon layers;
- each internal dielectric layer has a positive temperature coefficient of Young's modulus;
- each internal dielectric layer is in contact with central polysilicon layer;
- and
- each internal dielectric layer is offset from a center of the composite structure in the direction of the resonant vibration.
9 more elements
Dependencies are inferred from the claim text.