Antenna structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsiao-Tsung Yen
Life of this patent
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Abstract
An antenna formed on a semiconductor structure having a substrate with electrical circuits thereon operationally related to the functionality of an antenna and one or more metallic structures formed by a through silicon via, microbump, copper pillar, or redistribution layer proximate to the substrate. The one or more metallic structures form a radiating element of the antenna. Exemplary antennas thus formed can include a slot antenna, a WLAN slot antenna, a planar invented F antenna (PIFA), a spiral antenna, a dipole antenna, a Yagi antenna, a planar dipole antenna, a vertical dipole antenna, a patch antenna, a helical antenna, a loop patch antenna, and combinations thereof.
Claims20
A semiconductor structure comprising:
- a first die including a substrate having electrical circuits thereon operationally related to the functionality of an antenna;
- and
- a planar redistribution layer (RDL) parallel to a top surface of the substrate, the RDL having a planar polygonal antenna patch between the first die and a second die, the polygonal antenna patch parallel to the substrate and having a pair of lines extending away from the polygonal antenna patch on one side thereof, and an edge feed line extending from the one side of the polygonal antenna patch, with a respective inset gap between the edge feed line and each respective line of the pair of lines.
An antenna formed on a semiconductor structure comprising:
- a first die having a semiconductor substrate and electrical circuits thereon operationally related to the functionality of an antenna, the first die having a plurality of metal layers over the substrate and parallel to a face of the substrate,
- a redistribution layer that is an additional layer parallel to the substrate and located over the plurality of metal layers;
- a second die over the redistribution layer of the first die, the redistribution layer having one or more structures between the first and second dies,
- wherein the one or more structures include a planar polygonal patch antenna parallel to the face of the substrate.
Dependencies are inferred from the claim text.