Oxide film scheme for RRAM structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTrinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai, Ru-Liang Lee
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTrinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai, Ru-Liang Lee
Estimating the term…
The present disclosure relates to a method of forming an RRAM cell having a dielectric data layer that provides good performance, device yield, and data retention, and an associated apparatus. In some embodiments, the method is performed by forming an RRAM film stack having a bottom electrode layer disposed over a semiconductor substrate, a top electrode layer, and a dielectric data storage layer disposed between the bottom electrode and the top electrode. The dielectric data storage layer has a performance enhancing layer with a hydrogen-doped oxide and a data retention layer having an aluminum oxide. The RRAM film stack is then patterned according to one or more masking layers to form a top electrode and a bottom electrode, and an upper metal interconnect layer is formed at a position electrically contacting the top electrode.
An RRAM (resistive random access memory) cell, comprising:
An RRAM (resistive random access memory) cell, comprising:
An RRAM (resistive random access memory) cell, comprising:
Dependencies are inferred from the claim text.