Semiconductor device and method for manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsKazuo Shimokawa, Takashi Koyanagawa, Takeshi Miyagi, Akihiko Happoya, Kazuhito Higuchi, Tomoyuki Kitani
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AssigneeKabushiki Kaisha Toshiba
InventorsKazuo Shimokawa, Takashi Koyanagawa, Takeshi Miyagi, Akihiko Happoya, Kazuhito Higuchi, Tomoyuki Kitani
Estimating the term…
Provided is an optical semiconductor device includes: a light-emitting layer having a first main surface, a second main surface opposed to the first main surface, a first electrode and a second electrode which are formed on the second main surface; a fluorescent layer provided on the first main surface; a light-transmissive layer provided on the fluorescent layer and made of a light-transmissive inorganic material; a first metal post provided on the first electrode; a second metal post provided on the second electrode; a sealing layer provided on the second main surface so as to seal in the first and second metal posts with one ends of the respective first and second metal posts exposed; a first metal layer provided on the exposed end of the first metal post; and a second metal layer provided on the exposed end of the second metal post.
An optical semiconductor device to be mounted on a wiring board, comprising:
Dependencies are inferred from the claim text.