Packaging method and system for LEDs
AssigneeLuminus Devices, Inc.
InventorsMichael Lim, Paul Joseph Panaccione, Aaron Breen, Michael Hadley
Life of this patent
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Abstract
A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.
Claims12
A method of forming an optical line emitting LED curing system including the step of-arranging a plurality of LED packages side-by-side with each LED package including:
- a substrate having a length longer than a width;
- an electrical trace layer mounted to the substrate;
- and
- a dielectric layer electrically separating the electrical trace layer and the substrate,
- wherein the electrical trace layer contains an LED mounting area,
- wherein two substantially equidistant holes positioned on a proximal and distal side of the LED mounting area are formed through the substrate, the dielectric layer, and the electrical trace layer, and
- wherein each LED package includes a single mounted LED that is centro-symmetrically arranged with respect to the two holes and is centro-symmetrically positioned with the length and width of the substrate.
A packaged LED comprising:
- a substrate having a length longer than a width;
- an electrical trace layer mounted to the substrate;
- a dielectric layer electrically separating the electrical trace layer and the substrate, wherein the electrical trace layer contains a mounting area that is centro-symmetrically positioned with the length and width of the substrate, wherein the mounting area is configured to mount an LED chip, and wherein the electrical trace layer, dielectric layer and substrate contain two alignment holes that are positioned on either side of the mounting area;
- and
- an LED chip mounted on the mounting area, wherein the packaged LED includes a single LED chip that is centro-symmetrically positioned with the length and width of the substrate and with respect to the two alignment holes.
An LED line curing system comprised of a plurality of LED packages arranged side-by-side, wherein each package includes:
- a substrate having a length longer than a width,
- an electrical trace layer mounted to the substrate;
- a dielectric layer electrically separating the electrical trace layer and the substrate,
- wherein the electrical trace layer contains a mounting area centro-symmetrically positioned with the substrate, the dielectric layer, and the electrical trace layer,
- wherein the mounting area is configured to mount an LED,
- wherein the substrate, the dielectric layer, and the electrical trace layer contain two alignment holes that are positioned on either side of the mounting area;
- an LED chip mounted on the mounting area, wherein each LED package includes a single LED chip that is centro-symmetrically positioned with the length and width of the substrate and with respect to the two alignment holes.
An LED line curing system comprised of a plurality of LED packages arranged side-by-side, wherein each package includes:
- a substrate having a length longer than a width;
- an electrical trace layer mounted to the substrate;
- a dielectric layer electrically separating the electrical trace layer and the substrate,
- wherein the electrical trace layer contains a mounting area centro-symmetrically positioned with the substrate, the dielectric layer, and the electrical trace layer,
- wherein the mounting area is configured to mount an LED,
- wherein the substrate, the dielectric layer, and the electrical trace layer contain two alignment holes that are positioned on either side of the mounting area;
- and
- anode and cathode leads extending from proximal and distal ends of each LED package, and wherein each LED package is centro-symmetrically aligned about a mounted LED chip such that when each package is rotated about 180 degrees the cathode lead of one LED package juxtaposes the anode lead of another LED package, and the plurality of packages forms an optical line from the centro-symmetrically aligned LED chips wherein radiometric flux is emitted.
Dependencies are inferred from the claim text.