Process for producing layered member and layered member

A photoelectric surface member manufacturing method of manufacturing a photoelectric surface member for forming a photoelectric surface which emits photoelectrons excited by incident light, comprising the steps of:

• preparing a substrate for crystal growth which is a crystalline substance with the main surface in a predetermined plane orientation;
• forming a buffer layer along the main surface of said substrate for crystal growth;
• forming a nitride semiconductor crystal layer as a light absorbing layer on said buffer layer by crystal growth in the Group III element surface (positive c polar) direction using a Group III-V nitride type semiconductor material so that a surface of the nitride semiconductor crystal layer of the buffer layer side is a second surface which is a negative c polar surface;
• forming an adhesive layer on a first surface which is a positive c polar surface of said nitride semiconductor crystal layer;
• adhesively fixing a glass substrate which is formed to transmit incident light onto said adhesive layer;
• removing said substrate for crystal growth to obtain said buffer layer;
• removing said buffer layer to obtain said nitride semiconductor crystal layer having the second surface which is the negative c polar surface after the step of removing said substrate for crystal growth;
• and
• forming a layer containing alkali metal on the second surface of said nitride semiconductor crystal layer, wherein
• in said nitride semiconductor crystal layer, the first surface is an incidence surface where the light transmitted through the glass substrate enters, and the second surface is an emission surface which emits photoelectrons excited by the incident light through the layer containing alkali metal.