High density three-dimensional integrated capacitors

A component having electrodes for electrical interconnection with a circuit component or microelectronic element, comprising:

• a substrate consisting essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C., the substrate having a first surface, a second surface opposite the first surface, and an opening in the first surface having at least one dimension greater than 5 microns in a direction along the first surface, the opening extending between the first and second surfaces through a thickness of the substrate;
• and
• a capacitor, including:
• first and second electrically conductive plates connectable with respective first and second electric potentials, the first and second electrically conductive plates extending along an inner surface of the opening, the first and second electrically conductive plates being separated from one another by a dielectric layer, wherein the first and second electrically conductive plates extend between the first and second surfaces through the opening;
• first and second electrodes, the first electrode exposed at the first surface and electrically connected to the first electrically conductive plate, the second electrode exposed at the first surface and electrically connected to the second electrically conductive plate;
• and
• third and fourth electrodes exposed at the second surface and respectively electrically connected to the first and second plates.