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US 9,431,447 B2Granted
Package of finger print sensor and fabricating method thereof
AssigneeAmkor Technology, Inc.
InventorsJin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
Life of this patent
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Abstract
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
Claims20
A semiconductor device comprising:
- a semiconductor die comprising a first surface, a second surface opposite the first surface, and side surfaces connecting the first and second surfaces, where the first surface comprises a fingerprint sensor circuit and a plurality of bond pads;
- an encapsulant surrounding the side surfaces, but not the first and second surfaces, of the semiconductor die;
- a first lower passivation layer covering at least a portion of the first surface of the semiconductor die and comprising openings that expose the bond pads;
- first redistribution layers (RDLs) electrically connected to the bond pads exposed through the first lower passivation layer;
- a first upper passivation layer covering at least a portion of the second surface of the semiconductor die;
- a plurality of vias electrically connected to the first RDLs at a first end of the vias and passing through the encapsulant;
- second RDLs electrically connected to a second end of the vias and formed on the first upper passivation layer;
- a second upper passivation layer exposing first portions of the second RDLs and covering second portions of the second RDLs and at least a portion of the encapsulant;
- and
- electrical connection structures coupled to the exposed first portions of the second RDLs.
7 more elements
A semiconductor device comprising:
- a semiconductor die comprising a first die surface, a second die surface opposite the first die surface, and side die surfaces connecting the first and second die surfaces, where the first die surface comprises fingerprint sensor circuitry and a bond pad;
- an encapsulant covering at least one of the side die surfaces and comprising a first encapsulant surface and a second encapsulant surface opposite the first encapsulant surface;
- a conductive via passing through at least the encapsulant between the first encapsulant surface and the second encapsulant surface;
- a first conductive layer extending over at least a portion of the first die surface and over at least a portion of the first encapsulant surface, and electrically connecting the bond pad to a first end of the conductive via;
- a second conductive layer extending over at least a portion of the second encapsulant surface, and electrically connected to a second end of the conductive via;
- an electrical interconnection structure coupled to the second conductive layer;
- and
- a first dielectric layer between the first conductive layer and the first die surface and between the first conductive layer and the first encapsulant surface, wherein the first dielectric layer comprises a first aperture through which the first conductive layer and the bond pad are connected and a second aperture through which the first conductive layer and the first end of the conductive via are connected.
5 more elements
A semiconductor device comprising:
- a semiconductor die comprising a first die surface, a second die surface opposite the first die surface, and side die surfaces connecting the first and second die surfaces, where the first die surface comprises fingerprint sensor circuitry and a bond pad, and wherein the fingerprint sensor circuitry comprises image sensor circuitry;
- an encapsulant covering at least one of the side die surfaces and comprising a first encapsulant surface and a second encapsulant surface opposite the first encapsulant surface;
- a conductive via passing through at least the encapsulant between the first encapsulant surface and the second encapsulant surface;
- a first conductive layer extending over at least a portion of the first die surface and over at least a portion of the first encapsulant surface, and electrically connecting the bond pad to a first end of the conductive via;
- a second conductive layer extending over at least a portion of the second encapsulant surface, and electrically connected to a second end of the conductive via;
- and
- an electrical interconnection structure coupled to the second conductive layer.
4 more elements
A semiconductor device comprising:
- a semiconductor die comprising a first die surface, a second die surface opposite the first die surface, and side die surfaces connecting the first and second die surfaces, where the first die surface comprises fingerprint sensor circuitry and a bond pad, and wherein the semiconductor die is rectangular shaped with a first and second of the side die surfaces longer than a third and fourth of the side die surfaces;
- an encapsulant covering at least one of the side die surfaces and comprising a first encapsulant surface and a second encapsulant surface opposite the first encapsulant surface;
- a conductive via passing through at least the encapsulant between the first encapsulant surface and the second encapsulant surface;
- a first conductive layer extending over at least a portion of the first die surface and over at least a portion of the first encapsulant surface, and electrically connecting the bond pad to a first end of the conductive via;
- a second conductive layer extending over at least a portion of the second encapsulant surface, and electrically connected to a second end of the conductive via;
- an electrical interconnection structure coupled to the second conductive layer;
- a first dielectric layer that covers the first die surface;
- and
- a first conductive trace, wherein:
- the first conductive trace runs in a plane that is parallel to the first die surface and separated from the first die surface by at least the first dielectric layer;
- and
- the first conductive trace runs alongside the first side die surface along at least most of the length of the first side die surface.
9 more elements
A semiconductor device comprising:
- a semiconductor die comprising a first die surface, a second die surface opposite the first die surface, and side die surfaces connecting the first and second die surfaces, where the first die surface comprises fingerprint sensor circuitry and a bond pad;
- an encapsulant surrounding at least the side die surfaces;
- a first dielectric layer covering the first die surface and comprising an opening that exposes the bond pad;
- a first conductive layer electrically connected to the bond pad exposed through the first dielectric layer;
- a conductive via electrically connected to the first conductive layer at a first end of the via and passing through the encapsulant;
- a second conductive layer electrically connected to a second end of the via;
- and
- an electrical interconnection structure coupled to the second conductive layer.
5 more elements
Dependencies are inferred from the claim text.