Overmolded reconstructed camera module
AssigneeApple Inc.
InventorJulien C. Vittu
Life of this patent
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Abstract
A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.
Claims20
A camera module comprising:
- a microelectronic die having a top side and a bottom side, an image sensor is positioned on the top side of the microelectronic die and a conductive via is formed through the microelectronic die to provide an electrical connection between the top side and the bottom side;
- an overmold casing formed around the die, wherein the overmold casing is molded directly to, and contacts, at least a portion of the top side of the die;
- and
- a lens holder assembly coupled to the top side of the microelectronic die and the overmold casing.
A method of producing a camera module, the method comprising:
- providing a carrier having an adhesive tape layer;
- attaching a microelectronic die to the adhesive tape layer, the microelectronic die having a first side with an image sensor formed thereon and a second side, and wherein a conductive via is formed between the first side and the second side, the adhesive tape layer being attached to the second side;
- after attaching the microelectronic die to the adhesive tape layer, attaching a transparent member to the first side of the microelectronic die, the transparent member being positioned over the image sensor such that the image sensor is enclosed between the microelectronic die and the transparent member;
- and
- molding a mold material around exposed surfaces of the microelectronic die to form a casing around the microelectronic die and the transparent member.
A method of producing a camera module, the method comprising:
- providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor and a transparent member are positioned on the top side, a conductive via is formed through the image sensor die from the top side to the bottom side, and the casing is molded directly to a portion of the top side of the image sensor die and surrounds the transparent member;
- and
- coupling a lens holder assembly to the top side of the image sensor die.
Dependencies are inferred from the claim text.