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US 9,431,379 B2Granted
Signal transmission arrangement
AssigneeInfineon Technologies Austria AG
InventorsMartin Kerber, Jens-Peer Stengl, Uwe Wahl
Life of this patent
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Abstract
A signal transmission arrangement is disclosed. A voltage converter includes a signal transmission arrangement.
Claims23
A method of producing a signal transmission arrangement, the method comprising:
- providing a first semiconductor arrangement comprising a first semiconductor substrate having a first side and a second side, a first dielectric layer arranged on the first side of the first semiconductor substrate, and a first winding of a transformer arranged in the first dielectric layer, wherein the first semiconductor substrate has at least one contact terminal at the second side, and has a contact via extending through the first semiconductor substrate;
- and
- providing a second semiconductor arrangement comprising a second semiconductor substrate having a first side and a second side, a second dielectric layer arranged on the first side of the second semiconductor substrate, and a second winding of a transformer arranged in the second dielectric layer;
- arranging the first and second semiconductor arrangements such that the first and second dielectric layers adjoin one another.
1 more element
A method of producing a signal transmission arrangement, the method comprising:
- providing a first semiconductor arrangement comprising a first semiconductor body having a first side and a second side, a first dielectric layer arranged on the first side of the first semiconductor body, and a primary winding of a transformer arranged in the first dielectric layer;
- providing a second semiconductor arrangement comprising a second semiconductor body having a first side and a second side, a second dielectric layer arranged on the first side of the second semiconductor body, and a secondary winding of a transformer arranged in the second dielectric layer;
- at least one of the first or second semiconductor bodies having a contact via extending from the first side of the first or second semiconductor body into the first or second semiconductor body;
- mounting the second semiconductor arrangement to the first semiconductor arrangement such that the first and second dielectric layers face one another;
- and
- after mounting the second semiconductor arrangement to the first semiconductor arrangement;
- exposing the contact via by removing semiconductor material starting from the second side of the first or second semiconductor body that has the contact via.
4 more elements
A method of producing a signal transmission arrangement, the method comprising:
- providing a first semiconductor arrangement comprising a first semiconductor substrate having a first side and a second side, a first dielectric layer arranged on the first side of the first semiconductor substrate, and a first winding of a transformer arranged in the first dielectric layer;
- and
- providing a second semiconductor arrangement comprising a second semiconductor substrate having a first side and a second side, a second dielectric layer arranged on the first side of the second semiconductor substrate, and a second winding of a transformer arranged in the second dielectric layer;
- wherein in a horizontal plane parallel to a major surface of the first semiconductor substrate, the first winding has a smaller area than the second winding;
- arranging the first and second semiconductor arrangements such that the first and second dielectric layers adjoin one another.
2 more elements
Dependencies are inferred from the claim text.