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US 9,431,375 B2Granted
High density microelectronics packaging
AssigneeSchlumberger Technology Corporation
InventorsHarmel Jean Defretin, Tao Xu, Glenn Gardner
Life of this patent
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Abstract
Example packaging of microelectronics and example methods of manufacturing the same are provided herein. The packaging can enable and/or improve the use of the microelectronics in a downhole, high temperature and/or high pressure setting. The microelectronics packaging can include double-sided active components, heat sinks, and/or three-dimensional stacking of dies.
Claims22
A high temperature multi-chip module packaging comprising:
- a ceramic substrate having a first side and a second side;
- a housing having at least one hole extending therethrough, wherein the at least one hole has a first diameter portion and a second diameter portion, wherein a shoulder is formed between the first diameter portion and the second diameter portion, and wherein a diameter of the first diameter portion is different than a diameter of the second diameter portion;
- a plurality of metal posts that are brazed to the ceramic substrate and welded to the housing, wherein a base of a first of the metal posts is in physical contact with the shoulder;
- a first active die positioned on the first side of the ceramic substrate;
- a second active die stacked vertically on the first active die;
- one or more bonding pads attached to the first side of the ceramic substrate;
- a first bonding wire connected to the first active die and the one or more bonding pads;
- and
- a second bonding wire connected to the second active die and the one or more bonding pads.
6 more elements
A method for manufacturing a high temperature multi-chip module packaging comprising:
- providing a ceramic substrate having a first side and a second side, wherein a first active die is positioned on the first side of the ceramic substrate, a second active die is stacked vertically on the first active die, and a third active die is positioned on the second side of the ceramic substrate;
- connecting a first bonding wire to the first active die and to one or more bonding pads positioned on the first side of the substrate;
- connecting a second bonding wire to the second active die and to the one or more bonding pads;
- attaching the ceramic substrate to a plurality of metal posts by brazing;
- and
- attaching the metal posts to a housing by welding, wherein the housing has at least one hole extending therethrough, wherein the at least one hole has a first diameter portion and a second diameter portion, wherein a shoulder is formed between the first diameter portion and the second diameter portion, wherein a diameter of the first diameter portion is different than a diameter of the second diameter portion, and wherein a base of a first of the metal posts is in physical contact with the shoulder.
3 more elements
A high temperature multi-chip module packaging comprising:
- a ceramic substrate having a first side and a second side;
- a housing having at least one hole extending therethrough, wherein the at least one hole has a first diameter portion and a second diameter portion, wherein a shoulder is formed between the first diameter portion and the second diameter portion, and wherein a diameter of the first diameter portion is different than a diameter of the second diameter portion;
- a plurality of metal posts that are brazed to the ceramic substrate and subsequently welded to the housing, wherein a base of a first of the metal posts is in physical contact with the shoulder;
- a heat sink attached to the housing;
- a power consumption module disposed on the heat sink;
- a first active die positioned on the first side of the ceramic substrate;
- a second active die stacked vertically on the first active die;
- a third active die positioned on the second side of the ceramic substrate;
- one or more bonding pads attached to the first side of the ceramic substrate;
- a first bonding wire connected to and extending between the first active die and the one or more bonding pads;
- and
- a second bonding wire connected to and extending between the second active die and the one or more bonding pads.
9 more elements
Dependencies are inferred from the claim text.