Semiconductor package with a bridge interposer

A semiconductor package comprising:

• a bridge interposer having a first surface including alternating current (AC) signal pads;
• a first active die having a first portion and a second portion, the first portion of the first active die facing said first surface of said bridge interposer;
• and
• a second active die having a first portion and a second portion, the first portion of the second active die facing said first surface of said bridge interposer, the second portion of the first active die and the second portion of the second active die including solder balls mounted on a package substrate,
• wherein:
• said first active die and said second active die are configured to communicate AC chip-to-chip signals utilizing said AC signal pads of said bridge interposer,
• the first active die and the second active die are configured to communicate electrical signals to the package substrate utilizing the solder balls, and
• the solder balls are coupled to the second portion of the first active die and the second portion of the second active die by respective conductive pillars.

A semiconductor package comprising:

• a first die comprising a structure to receive or receiving a bond wire;
• a second die;
• and
• a bridge interposer situated over at least a portion of each of the first die and the second die, wherein the bridge interposer comprises an interposer dielectric with at least one routing trace formed in the interposer dielectric, the second die configured to communicate chip-to-chip signals with the first die through the at least one routing trace,
• wherein:
• a portion of the first die is not situated under the bridge interposer,
• the at least one routing trace has a first end for coupling to the first die and a second end for coupling to the second die, and
• the entire length of the at least one routing trace between the first end and the second end being within the interposer dielectric.