Antenna apparatus and method

A device comprising:

• a semiconductor die comprising a plurality of active circuits;
• a molding compound layer formed over the semiconductor die, wherein the semiconductor die and the molding compound layer form a fan-out package;
• a first through package via, a second through package via and a third through package via formed in the molding compound layer, wherein:
• the semiconductor die is between the first through package via and the second through package via;
• and
• the third through package via is between a top surface of the semiconductor die and a top surface of the molding compound layer;
• a first dielectric layer formed on a first side of the semiconductor die over the molding compound layer;
• a plurality of interconnect structures formed in the first dielectric layer;
• and
• an antenna structure formed on a top surface of the first dielectric layer and electrically connected to the plurality of active circuits through a first via, a metal line, a second via and the third through package via, wherein a top surface of the first via is in direct contact with a bottom surface of the antenna structure and a bottom surface of the first via is in direct contact with a top surface of the metal line, and wherein the antenna structure extends horizontally beyond sidewalls of the first through package via and the second through package via.

A method comprising:

• embedding a semiconductor die in a molding compound layer;
• forming a first group of through vias in the molding compound layer;
• forming a first interconnect structure on a first side of the semiconductor die, wherein the first interconnect structure is coupled the semiconductor die through the first group of through vias;
• depositing a first dielectric layer over the molding compound layer, wherein the first interconnect structure is embedded in the first dielectric layer;
• forming a post passivation interconnect over the first dielectric layer;
• and
• forming an antenna structure above the post passivation interconnect, wherein the antenna structure is electrically connected to the semiconductor die, wherein the antenna structure comprises a first metal line and a second metal line, and wherein the first metal line and the second metal line are placed in a symmetrical manner with respect to the semiconductor die.