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US 9,431,363 B1Granted
Wire bonded IC components to round wire
AssigneeAutomated Assembly Corporation
InventorsScott Lindblad, David Neuman, Robert Neuman
Life of this patent
Estimating the term…
Abstract
A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.
Claims24
A circuit arrangement, comprising:
- a substrate;
- an integrated circuit (IC) component attached to the substrate;
- one or more round wire segments attached to the substrate, the one or more round wire segments having first and second portions for connecting to the IC component, and each of the first and second portions having a respective planar landing area extending longitudinally along the one or more round wire segments;
- wherein each of the one or more round wire segments has a round cross section;
- and
- bond wires directly connected to the respective planar landing areas and to the IC component.
3 more elements
A method of making a circuit arrangement, comprising:
- attaching one or more round wire segments to a substrate, the one or more round wire segments having first and second portions;
- wherein each of the one or more round wire segments has a round cross section;
- forming planar landing areas on the first and second portions of the one or more round wire segments, respectively;
- attaching an integrated circuit (IC) component to the substrate;
- and
- wire bonding the planar landing areas to the IC component.
3 more elements
Dependencies are inferred from the claim text.