Semiconductor module
AssigneeFujitsu Limited
InventorYoichi Kawano
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes a first semiconductor chip including a first signal line and a first ground, a mounting board or a second semiconductor chip including a second signal line and a second ground, a signal line coupling bump that couples the first signal line and the second signal line with each other, a first ground coupling bump that couples the first ground and the second ground with each other, a signal line side insulating film including a capacitance that causes a series resonance with an inductance by the signal line coupling bump at a target frequency and a ground side insulating film including a capacitance that causes a series resonance with an inductance by the first ground coupling bump at a target frequency.
Claims6
A semiconductor module, comprising:
- a first semiconductor chip including a first signal line and a first ground;
- a mounting board or a second semiconductor chip including a second signal line and a second ground;
- a signal line coupling bump that couples the first signal line and the second signal line with each other;
- a first ground coupling bump that couples the first ground and the second ground with each other;
- a signal line side insulating film including a capacitance that causes a series resonance with an inductance by the signal line coupling bump at a target frequency;
- a ground side insulating film including a capacitance that causes a series resonance with an inductance by the first ground coupling bump at a target frequency;
- and
- a second ground coupling bump that couples the first ground and the second ground with each other and besides is coupled with the first ground coupling bump through a λ/4 line having a length equal to ¼ of a signal wavelength λ.
Dependencies are inferred from the claim text.