Ball arrangement for integrated circuit package devices

An integrated circuit package, comprising:

• a pattern of electrical contacts comprising:
• a first row comprising a first differential signal contact pair;
• a second row comprising a second differential signal contact pair;
• and
• a third row comprising at least one voltage supply contact,
• wherein:
• the first row is adjacent to at least one of the second row or the third row,
• the second row is adjacent to the third row, and
• the at least one voltage supply contact is arranged on a same column as one signal contact of the first differential signal contact pair and one signal contact of the second differential signal contact pair.

An integrated circuit package, comprising:

• a pattern of electrical contacts comprising:
• a first column comprising a first signal contact, a first voltage supply contact, and a second voltage supply contact;
• a second column comprising a second signal contact, a third signal contact, and a third voltage supply contact;
• and
• a third column comprising a fourth signal contact, a fourth voltage supply contact, and a fifth voltage supply contact,
• wherein:
• each of the first, second, third, and fourth signal contacts is one of a transmitter contact or a receiver contact,
• the second, third, and fifth voltage supply contacts are arranged in a same row, and
• the first signal contact and fourth voltage supply contact are in a same row.