Semiconductor structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsuan-Ting Kuo, Yu-Peng Tsai, Wei-Hung Lin, Chun-Lung Jao, Chao-Wen Shih, Ming-Da Cheng, Chung-Shi Liu
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Abstract
A semiconductor structure includes a substrate including a front side, a conductive bump disposed over the front side, and an opaque molding disposed over the front side and around a periphery portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side.
Claims20
A semiconductor structure, comprising:
- a substrate including a front side;
- a conductive bump disposed over the front side;
- and
- an opaque molding disposed over the front side and exposing a portion of an outer surface of the conductive bump,
- wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate, extended through the opaque molding and exposing the portion of the front side and an alignment feature disposed within the portion of the front side from the opaque molding, the recessed portion includes a height substantially same as a thickness of the opaque molding exposing the portion of the outer surface of the conductive bump.
A semiconductor structure, comprising:
- a substrate including a front side;
- a plurality of conductive bumps disposed over the front side of the substrate;
- a post passivation interconnect structure including a plurality of conductive traces routed within the front side of the substrate to electrically connect with the plurality of conductive bumps;
- and
- an opaque molding substantially covering the front side of the substrate and partially covering the plurality of conductive bumps,
- wherein the opaque molding includes a recessed portion exposing an alignment feature disposed at a corner of the front side of the substrate from the opaque molding, and the recessed portion includes a height substantially same as a thickness of the opaque molding partially covering the plurality of conductive bumps.
A semiconductor structure, comprising:
- a substrate including a front side;
- a conductive bump disposed over the front side;
- and
- an opaque molding disposed over the front side and surrounding the conductive bump,
- wherein the opaque molding includes a recessed portion extended through the opaque molding and exposing an alignment feature disposed over the front side, the recessed portion includes a height substantially same as a thickness of the opaque molding exposing a portion of the conductive bump.
Dependencies are inferred from the claim text.