Coaxial solder bump support structure

A structure comprising:

• a pedestal member comprising a conductive material coaxially surrounded by a protective insulator material in direct physical contact with the conductive material of the pedestal member, the pedestal member being above an inter-level dielectric layer;
• an insulator layer above the inter-level dielectric layer and adjacent to the pedestal member, wherein the protective insulator material and the insulator layer are part of a same layer, wherein the insulator layer extends horizontally from a lower portion of the protective insulator material along and in direct physical contact with a top surface of the inter-level dielectric layer, the insulator layer being the same material as the protective insulator material of the pedestal member, and a height of the insulator layer above the inter-level dielectric is less than a height of the pedestal member;
• a solder bump above the pedestal member, the solder bump being in electrical contact with the conductive via of the pedestal member;
• and
• an under bump metal layer between the pedestal member and the solder bump, the under bump metal layer being in direct physical contact with only a portion of an uppermost surface of the protective insulator material.

A structure comprising:

• a pedestal member comprising a conductive material coaxially surrounded by a protective insulator material in direct physical contact with the conductive material of the pedestal member, the pedestal member being above an inter-level dielectric layer;
• an insulator layer above the inter-level dielectric layer and adjacent to the pedestal member, wherein the protective insulator material and the insulator layer are part of a same layer, wherein the insulator layer extends horizontally from a lower portion of the protective insulator material along and in direct physical contact with a top surface of the inter-level dielectric layer, the insulator layer being the same material as the protective insulator material of the pedestal member, and a height of the insulator layer above the inter-level dielectric is less than a height of the pedestal member;
• and
• an under bump metal layer above the pedestal member, the under bump metal layer is in electrical contact with the conductive material of the pedestal member, and is in direct physical contact with only a portion of an uppermost surface of the protective insulator material of the pedestal member.