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US 9,431,357 B2Granted
Wiring board and high frequency module using same
AssigneePanasonic Corporation
InventorsRyosuke Shiozaki, Suguru Fujita
Life of this patent
Estimating the term…
Abstract
A high frequency module wiring board includes a wiring section for high frequency transmission, and a solder resist layer formed upon the wiring section. The solder resist layer covers the wiring section so as to have an opening section at a part of the wiring section in a region extending within a predetermined distance from an input/output terminal of a chip component.
Claims9
A high frequency module wiring board, comprising:
- a wiring section for high frequency transmission, the wiring section being arranged on the wiring board;
- and
- a solder resist layer that is formed on and contacts the wiring section;
- wherein the solder resist layer has an opening section at a part of the wiring section in a region extending within a predetermined distance from an input/output terminal of a surface mount type chip component mounted on the wiring board and the opening section of the solder resist layer is composed of a stripe-like pattern of solder resist so as to cover the wiring section at predetermined intervals.
1 more element
Dependencies are inferred from the claim text.