Wiring board and method for manufacturing the same

A method for manufacturing a wiring board, comprising:

• forming a wiring structure comprising a second insulation layer, a plurality of second conductive patterns formed on the second insulation layer, and a plurality of second mounting pads connected to the second conductive patterns;
• accommodating the wiring structure in a first insulation layer such that the wiring structure is positioned in the first insulation layer;
• forming on the first insulation layer a plurality of first conductive patterns including a plurality of first mounting pads such that the plurality of first mounting pads is positioned to mount a semiconductor element;
• and
• forming a plurality of third mounting pads on the first insulation layer above the second mounting pads such that the plurality of third mounting pads is connected to the second mounting pads, is positioned to mount the semiconductor element and forms a distance L4 between adjacent first and third mounting pads which is greater than a distance L1 between adjacent first mounting pads or a distance L5 between adjacent first and third mounting pads which is greater than a distance L2 between adjacent first mounting pads, wherein the forming of the third mounting pads includes forming the plurality of third mounting pads such that the third mounting pads are horizontally shifted in a same direction from the second mounting pads toward the semiconductor element.