US 9,431,337 B2Granted

Semiconductor device having an inner power supply plate structure

AssigneeNoda Screen Co., Ltd.

InventorSeisei Oyamada

Life of this patent

Estimating the term…

Loading patent…

Abstract

A power supply wiring structure of a semiconductor device including a semiconductor chip flip-chip mounted on a substrate decreases the characteristic impedance of internal wiring and thereby increases the noise reduction effect, while achieving low impedance during high frequency power supply operation. A semiconductor device has an inner power supply plate structure on a first insulating film on a protection film of a semiconductor chip, in an inner region of a plurality of peripheral electrode pads on a mounting surface of the semiconductor chip as viewed in plan, for supplying power to the semiconductor chip. The inner power supply plate structure includes a first power supply plate on the first insulating film, a second insulating film on the first power supply plate, and a second power supply plate on the second insulating film.

Claims8

Dependent claims

A semiconductor device comprising:

a substrate;
and
a semiconductor chip flip-chip mounted on the substrate,
wherein the semiconductor chip includes:
a plurality of peripheral electrode pads that are formed in a peripheral portion of a mounting surface facing the substrate and that are connected to the substrate;
and
a protection film formed on the mounting surface except for a portion where the plurality of peripheral electrode pads are formed,
the semiconductor device further comprising:
a first insulating film formed on the protection film of the semiconductor chip;
and
an inner power supply plate structure formed on the first insulating film in an inner region of the plurality of peripheral electrode pads in a plan view of the mounting surface, and configured to supply power to the semiconductor chip,
wherein the inner power supply plate structure includes:
a first power supply plate formed on the first insulating film;
a second insulating film formed on the first power supply plate;
and
a second power supply plate formed on the second insulating film.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/868,938Filed 29 Sep 2015
Priority: JP 2015-00417013 Jan 2015
Published: US 2016/0204058 A114 Jul 2016
Granted: 30 Aug 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10W 72/00
Interconnections or connectors in packages
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H10W 70/635
Vias, e.g. via plugs: through-vias