Wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorTakahiro Rokugawa
Life of this patent
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Abstract
A wiring substrate includes a wiring layer. Metal posts are arranged on the wiring layer. The metal posts are used to mount an electronic component. A protective layer covers a surface of the wiring layer on which the metal posts are arranged. The wiring layer includes a seed layer and a metal plating layer. The metal plating layer has a size that is the same as that of the seed layer in a plan view. The metal posts each include an upper end, which projects from the protective layer, and a lower end, which has a width that is the same as that of the upper end or greater. The protective layer includes a fillet for each metal post. The fillet extends toward an upper end surface of the corresponding metal post and contacts a side surface of the corresponding metal posts.
Claims16
A wiring substrate comprising:
- a wiring layer;
- metal posts arranged on the wiring layer, wherein the metal posts are used to mount an electronic component;
- and
- a protective layer that covers a surface of the wiring layer on which the metal posts are arranged;
- wherein the wiring layer includes a seed layer and a metal plating layer formed on the seed layer, wherein the metal plating layer has a size that is the same as a size of the seed layer in a plan view;
- the metal posts each include an upper end, which projects from the protective layer, and a lower end, which is buried in the protective layer and has a width that is the same as or greater than a width of the upper end;
- and
- the protective layer includes a fillet for each of the metal posts, wherein the fillet extends toward an upper end surface of a corresponding one of the metal posts and contacts a side surface of the corresponding one of the metal posts,
- wherein each of the metal posts has a cylindrical shape or a polygonal rod shape,
- surfaces of the wiring layer and the surfaces of the metal posts are roughened,
- the roughened surfaces of the wiring layer and the surfaces of the metal posts have a greater roughness than the surface of the wiring layer on which the metal posts are arranged.
A wiring substrate comprising:
- a wiring layer;
- metal posts arranged on the wiring layer, wherein the metal posts are used to mount an electronic component;
- and
- a protective layer that covers a surface of the wiring layer on which the metal posts are arranged;
- wherein the wiring layer includes a seed layer and a metal plating layer formed on the seed layer, wherein the metal plating layer has a size that is the same as a size of the seed layer in a plan view;
- the metal posts each include an upper end, which projects from the protective layer, and a lower end, which is buried in the protective layer and has a width that is the same as or greater than a width of the upper end;
- and
- the protective layer includes a fillet for each of the metal posts, wherein the fillet extends toward an upper end surface of a corresponding one of the metal posts and contacts a side surface of the corresponding one of the metal posts,
- the wiring substrate further comprising an insulation layer formed on a surface of the wiring layer opposite to the surface on which the metal posts are arranged,
- wherein the protective layer includes an opening that exposes a portion of an upper surface of the insulation layer.
A wiring substrate comprising:
- a wiring layer;
- metal posts arranged on the wiring layer, wherein the metal posts are used to mount an electronic component;
- and
- a protective layer that covers a surface of the wiring layer on which the metal posts are arranged;
- wherein the wiring layer includes a seed layer and a metal plating layer formed on the seed layer, wherein the metal plating layer has a size that is the same as a size of the seed layer in a plan view;
- the metal posts each include an upper end, which projects from the protective layer, and a lower end, which is buried in the protective layer and has a width that is the same as or greater than a width of the upper end;
- and
- the protective layer includes a fillet for each of the metal posts, wherein the fillet extends toward an upper end surface of a corresponding one of the metal posts and contacts a side surface of the corresponding one of the metal posts,
- wherein:
- the wiring layer includes a first wire, on which the metal posts are arranged, and a second wire that is free from the metal posts;
- and
- the protective layer includes an opening that exposes a portion of an upper surface of the second wire.
Dependencies are inferred from the claim text.