System and method for metal matrix mounting scheme
AssigneeHamilton Sundstrand Corporation
InventorsEric Karlen, William Louis Wentland, John Horowy, Debabrata Pal
Life of this patent
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Abstract
An integrated circuit assembly element formed via an additive manufacturing technique, such as mixing a conductive material with a memory metal to form a portion of a substrate in desired locations, such as along the footprint of die, are discussed herein. In operation (e.g. in response to thermal cycling of the assembly) the memory metal contracts while the conductive material expands. The result is an element having reduced thermal expansion, which can be net zero coefficient of thermal expansion and/or be catered to the coefficient of thermal expansion of a desired material, such as the silicon die.
Claims15
A bus bar comprising:
- a first portion comprising:
- a thermally conductive material;
- and
- a second portion comprising:
- a memory metal internal framework;
- and
- the thermally conductive material applied to the memory metal internal framework through an additive manufacturing technique to form a memory metal thermally conductive composite material,
- wherein the memory metal thermally conductive composite material comprise a substantially net zero coefficient of thermal expansion during operation of the bus bar.
A surface mounted silicon die attachment process comprising:
- coupling a surface mounted silicon die to a substrate such the desired thermal transfer path of the surface mounted silicon die overlaps a first portion of the substrate comprising a thermally conductive material;
- and
- coupling the surface mounted silicon die to the substrate such that a perimeter of a footprint of the surface mounted silicon die overlaps a second portion of substrate comprising a composition of a memory metal and the thermally conductive material,
- wherein the composition of the memory metal and the thermally conductive material comprise a substantially net zero coefficient of thermal expansion during operation of the surface mounted silicon die.
Dependencies are inferred from the claim text.