US 9,431,328 B1Granted

Power device and preparation method thereof

AssigneeAlpha and Omega Semiconductor Incorporated

InventorsHamza Yilmaz, Yan Xun Xue, Jun Lu

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Abstract

A power semiconductor package and a method of preparation are disclosed. The power semiconductor package includes a pair of first and second die paddles arranged side by side, a first semiconductor chip attached to the first die paddle, a second semiconductor chip attached to the second die paddle, a metal clip electrically connecting a first electrode at the top surface of the first semiconductor chip and a first electrode at the top surface of the second semiconductor chip to a second pin, a first conductive structure connecting a second electrode at the top surface of a first semiconductor chip to a first pin, and a second conductive structure connecting a second electrode at the top surface of the second semiconductor chip to a third pin. In examples of the present disclosure, double-chip common source technique for the source electrodes of two power MOSFETs is achieved by applying a T-shape metal clip.

Claims9

Dependent claims

A power device comprising:

a pair of first and second die paddles arranged side by side;
a pair of first and second semiconductor chips, the first semiconductor chip being attached to the first die paddle and the second semiconductor chip being attached to the second die paddle;
a first pin, a second pin and a third pin located in proximity to the first and second die paddles;
a metal clip electrically connecting a first electrode at a top surface of the first semiconductor chip and a first electrode at a top surface of the second semiconductor chip to the second pin;
a first conductive structure connecting a second electrode at the top surface of the first semiconductor chip to the first pin;
and
a second conductive structure connecting a second electrode at the top surface of the second semiconductor chip to the third pin;
wherein the metal clip is of T-shape configuration comprising a first portion and a second portion perpendicular to the first portion;
wherein the first portion of the metal clip overlaps on the pair of the first and second semiconductor chips attached to the first and second die paddles respectively;
wherein one end of the first portion of the metal clip is attached to the first electrode at the top surface of the first semiconductor chip and another end of the first portion of the metal clip is attached to the first electrode at the top surface of the second semiconductor chip;
and
wherein a free end of the second portion of the metal clip is bent down and extends horizontally to form a down-set portion attached to the second pin.

9 more elements

Dependencies are inferred from the claim text.