US 9,431,327 B2 · Semiconductor device

Abstract

A semiconductor device includes a lead frame, a first semiconductor component, a second semiconductor component, and a first conductive member. The lead frame includes a first segment having a first bottom plate, and a second segment having a second bottom plate. The first segment and the second segment are arranged side by side, the first bottom plate is spatially isolated from the second bottom plate, and the first bottom plate is thicker than the second bottom plate. The first semiconductor component is disposed on the first bottom plate, and the second semiconductor component is disposed on the second bottom plate. The second semiconductor component is thicker than the first semiconductor component. The first conductive member electrically connects the second semiconductor component to the first segment.

Claims19

Dependent claims

A semiconductor device comprising:

a lead frame comprising a first segment and a second segment arranged side by side with the first segment, wherein the first segment is spatially isolated from the second segment;
a first semiconductor component having a top side and a bottom side, wherein the bottom side of the first semiconductor component is disposed on the first segment;
a second semiconductor component having a top side and a bottom side, wherein the second semiconductor component is thicker than the first semiconductor component, and the bottom side of the second semiconductor component is disposed on the second segment;
and
a first conductive member electrically connecting the second semiconductor component to the first segment,
wherein the top side of the first semiconductor component and the top side of the second semiconductor component are substantially at the same level.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims19