Electronic device

An electronic device comprising:

• a heat sink having a heat receiving surface;
• a substrate having an opposed surface and being supported through a plurality of support portions such that the opposed surface is opposed to the heat receiving surface of the heat sink;
• a one-side heat radiation element being disposed on the opposed surface of the substrate and being configured to radiate heat to the substrate, the one-side heat radiation element being an electronic element and including:
• a first chip;
• a first substrate-side conductive portion being disposed adjacent to the substrate than the first chip and being electrically connected to the substrate;
• and
• a rear-surface covered conductive portion being disposed further from the substrate than the first chip, being electrically connected to the substrate through a first conductive terminal, and having a surface being covered with a molded resin adjacent to the heat sink;
• a two-side heat radiation element being disposed on the opposed surface of the substrate and being configured to radiate heat to the substrate and the heat receiving surface of the heat sink, the two-side heat radiation element being an electronic element and including:
• a second chip;
• a second substrate-side conductive portion being disposed adjacent to the substrate than the second chip and being electrically connected to the substrate;
• a rear-surface exposed conductive portion being disposed further from the substrate than the second chip, being electrically connected to the substrate through a
• second conductive terminal, and having a surface without being covered with the molded resin adjacent to the heat sink;
• and
• an electrically insulating and heat radiating material having heat conductivity and being filled at least in between the rear-surface exposed conductive portion of the two-side heat radiation element and the heat receiving surface of the heat sink, wherein
• the one-side heat radiation element has a height greater than a height of the two-side heat radiation element with respect to a direction perpendicular to a planar direction of the substrate,
• the electrically insulating and heat radiating material filled in between the rear-surface exposed conductive portion of the two-side heat radiation element and the heat receiving surface of the heat sink has a thickness that is equal to or greater than a minimum thickness necessary to endure electric insulation, and
• the two-side heat radiation element is located between at least one of the plurality of support portion and the one-side heat radiation element with respect to a planar direction of the substrate.