Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package

A method of bonding a circuit package to a first heat sink structure of a power doubler amplifier, the power doubler amplifier comprising a printed circuit board;

• the circuit package mounted to the printed circuit board, the circuit package having a thermal pad;
• and the first heat sink structure associated with the printed circuit board having a wall defining a contact surface that contacts and thermally couples with the thermal pad, the method comprising:
• defining at least one aperture through the wall, and
• outgassing solder paste via the at least one aperture while bonding the contact surface to the thermal pad using solder paste,
• wherein the circuit package comprises a Quad Flatpack No lead (QFN) package having a power consumption as high as about 17.7 W/cm2.

An apparatus comprising:

• a printed circuit board;
• a circuit package comprising a QFN (Quad Flatpack No lead) package surface mounted to the printed circuit board, the circuit package having a thermal pad and having a power consumption as high as about 17.7 W/cm2;
• a heat sink structure carrying the printed circuit board and having a protrusion extending through the printed circuit board, the protrusion having a wall defining a contact surface that contacts and thermally couples with the thermal pad, the wall including at least one aperture there-through, and
• solder paste between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste,
• wherein the apparatus is a power doubler amplifier.