Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device
AssigneeHitachi Chemical Company, Ltd.
InventorsTetsuya Enomoto, Emi Miyazawa, Kazutaka Honda, Akira Nagai, Keisuke Ookubo
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Abstract
A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.
Claims7
A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 150 nm and no greater than 500 nm;
- wherein:
- said thermosetting resin and said flux agent are separate ingredients,
- said thermosetting resin composition is in the form of a film,
- said thermosetting resin contains an epoxy resin which is solid at 25° C.
- wherein the inorganic filler with a mean particle size of no greater than 100 nm is surface-treated, and
- wherein the inorganic filler with a mean particle size of greater than 150 nm and no greater than 500 nm is non-surface-treated.
Dependencies are inferred from the claim text.