Plasma processing method and apparatus
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAtsushi Harikai, Noriyuki Matsubara, Mitsuru Hiroshima
Life of this patent
Estimating the term…
Abstract
A plasma processing method to a substrate includes a first step of mounting a transfer carrier holding the substrate on a stage which is cooled and provided within a processing chamber; a second step of relatively moving the stage and a cover provided above the stage to cover a holding sheet and an annular frame of the transfer carrier with the substrate exposed from a window part formed at the cover, a third step of carrying out plasma processing on the substrate, a fourth step of cooling the cover, and a fifth step of unloading the transfer carrier holding the substrate from the processing chamber.
Claims8
A plasma processing method of carrying out plasma processing within a processing chamber on a substrate which is held by a transfer carrier constituted of an annular frame and a holding sheet, the method comprising:
- a first step of mounting the transfer carrier holding the substrate on a stage which is cooled and provided within the processing chamber;
- a second step of changing a distance between the stage and a cover provided above the stage to cover the holding sheet and the frame of the transfer carrier by the cover in a state of exposing the substrate from a window part formed at the cover;
- a third step of carrying out plasma processing on the substrate held by the transfer carrier;
- a fourth step of cooling the cover;
- and
- a fifth step of unloading the transfer carrier holding the substrate from the processing chamber,
- wherein in the fourth step, heat transfer gas is introduced to the processing chamber to cool the cover while the heat transfer gas is exhausted by a pressure reducing mechanism.
Dependencies are inferred from the claim text.