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US 9,431,262 B2Granted
Method for polishing work and work polishing apparatus
AssigneeFujikoshi Machinery Corp.
InventorsKazutaka Shibuya, Yoshio Nakamura
Life of this patent
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Abstract
The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
Claims9
A method for polishing a work, comprising the steps of:
- pressing a surface of the work onto a polishing part of a rotating polishing plate;
- supplying slurry while performing the pressing step;
- and
- generating an activated gas in a form of a plasma, which has been generated by gas discharge, is turned into micro-nano bubbles and mixed into the slurry.
1 more element
A method for polishing a work, comprising the steps of:
- providing an activated gas in a form of a plasma;
- supplying the activated gas in the form of the plasma to a bubble generating device to form micro-nano bubbles;
- introducing water into the bubble generating device;
- providing a rotating polishing plate;
- supply the water with the activated gas turned into micro-nano bubbles to the rotating polishing plate;
- supplying a slurry to the rotating polishing plate;
- pressing a surface of the work onto a polishing part of the rotating polishing plate supplied with the water with the activated gas turned into micro-nano bubbles and the slurry;
- and
- polishing the work.
6 more elements
A method for polishing a work, comprising the steps of:
- providing an activated gas in a form of a plasma;
- supplying the activated gas in the form of the plasma to a bubble generating device to form micro-nano bubbles;
- introducing water into the bubble generating device;
- introducing a slurry into the bubble generating device;
- providing a rotating polishing plate;
- supply the water with the activated gas turned into micro-nano bubbles and the slurry to the rotating polishing plate;
- pressing a surface of the work onto a polishing part of the rotating polishing plate supplied with the water with the activated gas turned into micro-nano bubbles and the slurry;
- and
- polishing the work.
6 more elements
Dependencies are inferred from the claim text.