Memory circuit and cache circuit configuration
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Hsin Sean Lee, William Wu Shen, Yun-Han Lee
Life of this patent
Estimating the term…
Abstract
A cache memory die includes a substrate, a predetermined number of sets of memory cells on the substrate, a first set of input/output terminals on a first surface of the cache memory die, and a second set of input/output terminals on a second surface of the cache memory die. The first set of input/output terminals are connected to a primary memory circuit outside the cache memory die. A portion of the second set of input/output terminals are compatible with the first set of input/output terminals.
Claims20
A memory circuit comprising:
- a first memory circuit formed of a first die or a set of stacked dies, the first memory circuit comprising P sets of memory cells of a first type, each set of the memory cells of the first type having Q input/output (I/O) terminals, P and Q being integers greater than 1;
- a second memory circuit formed of a second die, the second memory circuit comprising D set(s) of memory cells of a second type disposed towards a periphery of the second die, the memory cells of the second type being readable at a speed faster than the memory cells of the first type, and each set of the memory cells of the second type comprising P subsets of Q*N memory cells of the second type, each of the P subsets of memory cells of the second type associated with a corresponding one of the P sets of memory cells of the first type, D and N being positive integers, the first die or the set of stacked dies being stacked over the second die wherein the second die further includes a first plurality of I/O terminals and a second plurality of I/O terminals within a central portion of the second die that is disposed between the sets of memory cells of the second type, the first plurality of I/O terminals being electrically coupled to the first memory circuit by through-silicon vias, and the second plurality of I/O terminals being electrically isolated from the first memory circuit and disposed such that at least one terminal of the second plurality of I/O terminals is between each terminal of the first plurality of I/O terminals and the sets of memory cells;
- a memory controller circuit electrically coupled with the first memory circuit through the through-silicon vias in the second die, the memory controller circuit being configured to access the P sets of memory cells of the first type;
- and
- a cache controller circuit electrically coupled with the memory controller circuit and the second memory circuit, the cache controller circuit being configured to receive a read command for reading requested data stored in the first memory circuit at a read address and to retrieve a valid duplication of the requested data from the second memory circuit if the valid duplication of the requested data exists in the second memory circuit.
A cache memory die comprising:
- a substrate;
- a predetermined number of sets of memory cells on the substrate;
- a first set of input/output terminals on a first surface of the cache memory die, the first set of input/output terminals configured to be coupled to a primary memory circuit outside the cache memory die, wherein the primary memory circuit is on a die different from the cache memory die;
- and
- a second set of input/output terminals on a second surface of the cache memory die disposed between the sets of memory cells, a first portion of the second set of input/output terminals being pin-to-pin compatible with the first set of input/output terminals, and a second portion of the second set of input/output terminals being not corresponding to any input/output terminal on the first surface of the cache memory, wherein the second portion of the second set of input/output terminals is disposed around the first portion and between the first portion and the sets of memory cells.
A cache circuit comprising:
- a first die, comprising:
- a predetermined number of sets of memory cells;
- a first set of bumps on a first surface of the first die, the first set of bumps being configured to be coupled to a primary memory circuit outside the cache circuit,
- wherein the primary memory circuit is on a die different from the cache circuit;
- and
- a second set of bumps on a second surface of the first die, a first portion of the second set of bumps being pin-to-pin compatible with the first set of bumps and a second portion of the second set of bumps not being configured for electrical coupling to the primary memory circuit, wherein the second portion is disposed at a periphery of the first portion;
- and
- a second die comprising a cache controller electrically coupled with the first die through a second portion of the second set of bumps, the cache controller being configured to receive a read command for reading requested data corresponding to a read address and to output the data from the first die if the first die has a valid duplication of the requested data.
Dependencies are inferred from the claim text.