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US 9,430,605 B2Granted
Adjusting sizes of connectors of package components
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
Life of this patent
Estimating the term…
Abstract
A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
Claims20
A method comprising:
- forming a plurality of connectors on a top surface of a package component, wherein the forming the plurality of connectors comprises:
- forming a first plurality of connectors in a first local surface region of the package component, wherein each of the first plurality of connectors has a first top-view area, and the first local surface region has a first connector density equal to a ratio of a total top-view area of all connectors in the first local surface region to a total top-view area of the first local surface region;
- and
- forming a second plurality of connectors in a second local surface region of the package component, wherein each of the second plurality of connectors has a second top-view area different from the first top-view area, wherein the second local surface region has a second connector density equal to a ratio of a total top-view area of all connectors in the second local surface region to a total top-view area of the second local surface region, and wherein the first connector density is substantially equal to the second connector density.
1 more element
A method comprising:
- making a first design of a package component to generate a plurality of connectors having a uniform top-view area at a surface of the package component, wherein the plurality of connectors comprises a first plurality of connectors in a first local surface region of the package component and a second plurality of connectors in a second local surface region of the package component;
- modifying the first design of the package component to generate a second design, wherein the modifying the first design comprises at least one of:
- reducing the uniform top-view area of the first plurality of connectors in the first design to a first top-view area in the second design;
- and
- increasing the uniform top-view area of the second plurality of connectors in the first design to a second top-view area in the second design;
- and
- performing a manufacturing process to implement the second design of the package component on the package component, wherein the manufacturing process comprises plating the first and the second plurality of connectors.
4 more elements
A method comprising:
- making a first design of a package component to generate a plurality of connectors at a surface of the package component, with the plurality of connectors having a uniform top-view area, wherein the plurality of connectors comprises a first plurality of connectors in a first local surface region of the package component and a second plurality of connectors in a second local surface region of the package component;
- calculating an average connector density of all connectors in the first design of the package component;
- and
- modifying the first plurality of connectors to generate a second design of the package component, wherein in the first design, each of the first plurality of connectors has a first top-view area, and in the second design, each of the first plurality of connectors has a second top-view area different from the first top-view area;
- and
- performing a manufacturing process to implement the second design of the package component on the package component, wherein the manufacturing process comprises plating solder to form the first plurality of connectors.
3 more elements
Dependencies are inferred from the claim text.