Computing device with heat spreader
AssigneeGoogle Inc.
InventorJeffrey Hayashida
Life of this patent
Estimating the term…
Abstract
The computing device includes an enclosure including a first structure, a second structure aligned parallel to the first structure and a third structure disposed between the first structure and the second structure, the third structure including a thermally non-conductive material, a heat generating element in contact with the third structure, and a flexible sheet in contact with the heat generating element and the second structure, the flexible sheet configured to conduct heat generated by the heat generating element away from the first structure and to a surface of the second structure.
Claims18
A computing device, comprising:
- an enclosure including a first structure, a second structure aligned parallel to the first structure and a third structure disposed between the first structure and the second structure, the third structure including a thermally non-conductive material;
- a first element and a second element each in contact with the third structure, the first element being a processor and the second element being a non-processor element;
- and
- a flexible sheet including:
- a first portion having a first surface in contact with at least one of a surface of the first element and a thermally conductive material in contact with the surface of the first element and the first portion having a second surface in contact with at least one of a surface of the second structure and the thermally conductive material in contact with the surface of the second structure,
- a second portion positioned substantially perpendicular to the third structure, and
- a third portion in contact with a surface of the first structure and substantially parallel to the first portion, the flexible sheet configured to conduct heat generated by the first element away from the first structure and to a surface of the second structure, the flexible sheet including a cutout through which the second element is inserted.
A computing device, comprising:
- an enclosure including a first structure, a second structure aligned parallel to the first structure, a third structure disposed between the first structure and the second structure, the third structure including a thermally non-conductive material, and a fourth structure aligned substantially perpendicular to the first structure;
- a first element and a second element each in contact with the third structure, the first element being a processor and the second element being a non-processor element;
- and
- a flexible sheet including:
- a first portion having a first surface in contact with at least one of a surface of the first element and a thermally conductive material in contact with the surface of the first element and the first portion having a second surface in contact with at least one of a surface of the second structure and the thermally conductive material in contact with the surface of the second structure,
- a second portion positioned on surface of the second structure, substantially parallel to the third structure, and
- a third portion in contact with the fourth structure and substantially perpendicular to the first portion, the flexible sheet being configured to conduct heat generated by the first element away from the first structure and to a surface of the fourth structure configured to dissipate heat, the flexible sheet including a cutout through which the second heat generating element is inserted.
Dependencies are inferred from the claim text.