Wafer level packaged optical subassembly and transceiver module having same
AssigneeSAE Magnetics (H.K.) Ltd.
InventorsWei Ma, Wai Hung, Francis Guillen Gamboa, Xiaoming Yu, Dennis Tak Kit Tong
Life of this patent
Estimating the term…
Abstract
An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.
Claims19
An optical subassembly comprising:
- a TSV submount layer carrying an active optical component;
- and
- a sandwich cap bonded to the TSV submount layer;
- wherein:
- the sandwich cap comprises a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer;
- a cavity is defined in the bottom spacer layer and configured for accommodating the active optical component;
- at least one first lens is formed on the glass layer and is opposite to the active optical component;
- an alignment feature is formed in the upper spacer layer;
- and
- the TSV submount layer comprises a structure with a first hole with metal deposited surrounding and a second hole filled by metal to achieve a hermetic package by sealing a silicon through via in the TSV submount layer.
An optical transceiver module comprising:
- an optical subassembly, the optical subassembly comprising a TSV submount layer carrying an active optical component and a sandwich cap with an optical window and an alignment feature bonded to the TSV submount layer;
- a jumper detachably mounted to the optical subassembly with the alignment feature;
- and
- an optical fiber detachably mounted to the jumper;
- wherein:
- the sandwich cap comprises a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer;
- a cavity is defined in the bottom spacer layer and configured for accommodating the active optical component;
- at least one first lens is formed at a side of the glass layer that is facing the cavity;
- at least one second lens is formed on a bottom surface of the jumper towards the first lens;
- and
- the TSV submount layer comprises a structure with a first hole with metal deposited surrounding and a second hole filled by metal to achieve a hermetic package by sealing a silicon through via in the TSV submount layer.
A method for fabricating an optical subassembly, the method comprising:
- preparing a TSV submount layer;
- die bonding and wire bonding for mounting an active optical component to the TSV submount layer;
- forming a sandwich cap with an optical window and an alignment feature;
- and
- bonding the sandwich cap to the TSV submount layer;
- wherein:
- the sandwich cap comprises a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer;
- a cavity is defined in the bottom spacer layer and configured for accommodating the active optical component;
- a first lens or lens array is formed at a side of the glass layer that is facing the cavity;
- and
- the TSV submount layer comprises a structure with a first hole with metal deposited surrounding and a second hole filled by metal to achieve a hermetic package by sealing a silicon through via in the TSV submount layer.
Dependencies are inferred from the claim text.