# US 9,429,702 B2 · Light guide structure and backlight module

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- Number: US 9,429,702 B2
- Document ID: US9429702B2
- Status: Granted
- Kind: B2
- Application number: 14/838,380
- Filed: 2015-08-28
- Published: 2015-12-24
- Granted: 2016-08-30
- Earliest claimed: 2009-05-12
- Assignees: Global Lighting Technologies Inc.
- Applicants: Global Lighting Technologies Inc.
- Inventors: Chung-Lin Tsai; Jiun-Hau Ie; Jerry Wu
- Web page: https://patentgrep.com/patent/US9429702B2

## CPC

- G02B 6/0083: {Details of electrical connections of light sources to drivers, circuit boards, or the like}
- G02B 6/0021: {for housing at least a part of the light source, e.g. by forming holes or recesses}
- G02B 6/0065: {Manufacturing aspects; Material aspects}
- G02B 6/0068: {Arrangements of plural sources, e.g. multi-colour light sources}
- G02B 6/0073: {Light emitting diode [LED]}
- G02B 6/0085: {Means for removing heat created by the light source from the package}
- G02B 6/009: {of the light source in the package (G02B6/0021 takes precedence)}
- B29K 2101/12: Thermoplastic materials
- B29K 2995/0026: Transparent
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

A backlight module including a light source module and a light guide structure is provided. The light source module includes a base, at least one light source and a first circuit layer. The base includes a carrying surface. The at least one light source is mounted on the carrying surface. The first circuit layer is integrated with the carrying surface and electrically connected to the light source. The light guide plate includes an engaging surface and at least one recess. The engaging surface is engaged with the light source module. The recess is disposed at the engaging surface for receiving the light source, wherein a material of the light guide plate and a material of the base are the same. The second circuit layer is integrated with the engaging surface, and electrically connected to the first circuit layer.

## Claims

### Claim 1

A light guide structure, adapted to be engaged with a light source module, wherein the light source module comprising a base and at least one light source mounted thereon, and the light guide structure comprising:
a light guide plate comprising an engaging surface and at least one recess, wherein the engaging surface is adapted to be engaged with the light source module, the recess is disposed at the engaging surface for receiving the light source, a material of the light guide plate and a material of the base are the same; and
a circuit layer integrated with the engaging surface for electrically connecting the light source.

### Claim 2 (depends on 1)

The light guide structure in claim 1, wherein the light source is a flip chip light-emitting diode (LED).

### Claim 3 (depends on 1)

The light guide structure in claim 1, wherein the light source is a LED chip scale package (CSP).

### Claim 4 (depends on 1)

The light guide structure in claim 1, wherein the material of the light guide plate and the base is polycarbonate (PC).

### Claim 5 (depends on 1)

The light guide structure in claim 1, wherein the material of the light guide plate and the base is polyethylene terephthalate (PET).

### Claim 6 (depends on 1)

The light guide structure in claim 1, wherein a material of the circuit layer is indium tin oxide (ITO).

### Claim 7 (depends on 1)

The light guide structure in claim 1, further comprising an optical clear adhesive (OCA) disposed between the light guide plate and the base for bonding the light guide structure and the light source module.

### Claim 8 (depends on 1)

The light guide structure in claim 1, wherein the circuit layer is a sheet material integrated with the engaging surface and a plurality of wirings printed on the sheet material.

### Claim 9

A backlight module, comprising:
a light source module, comprising:
a base comprising a carrying surface;
at least one light source mounted on the carrying surface; and
a first circuit layer integrated with the carrying surface and electrically connected to the light source; and
a light guide structure, comprising:
a light guide plate comprising an engaging surface and at least one recess, the engaging surface engaged with the light source module, the recess disposed at the engaging surface for receiving the light source, wherein a material of the light guide plate and a material of the base are the same; and
a second circuit layer integrated with the engaging surface, and electrically connected to the first circuit layer.

### Claim 10 (depends on 9)

The backlight module in claim 9, wherein the light source is a flip chip light-emitting diode (LED).

### Claim 11 (depends on 9)

The backlight module in claim 9, wherein the light source is a LED chip scale package (CSP).

### Claim 12 (depends on 9)

The backlight module in claim 9, wherein the material of the light guide plate and the base is polycarbonate (PC).

### Claim 13 (depends on 9)

The backlight module in claim 9, wherein the material of the light guide plate and the base is polyethylene terephthalate (PET).

### Claim 14 (depends on 9)

The backlight module in claim 9, wherein a material of the first circuit layer and the second circuit layer is indium tin oxide (ITO).

### Claim 15 (depends on 9)

The backlight module in claim 9, further comprising an optical clear adhesive (OCA) disposed between the light guide plate and the base for bonding the light guide structure and the light source module.

### Claim 16 (depends on 9)

The backlight module in claim 9, wherein each of the first circuit layer and the second circuit layer is a sheet material and a plurality of wirings printed on the sheet material.

### Claim 17 (depends on 9)

The backlight module in claim 9, wherein the first circuit layer comprises a plurality of first contacts, and the second circuit layer comprises a plurality of second contacts, the first contacts are electrically connected with the second contacts.

### Claim 18 (depends on 17)

The backlight module in claim 17, further comprising a reflective solder resist layer covering the carrying surface and exposing the second contacts.

### Claim 19 (depends on 9)

The backlight module in claim 9, wherein the base further comprises a back surface opposite to the carrying surface, and a reflective sheet disposed on the back surface.

### Claim 20 (depends on 9)

The backlight module in claim 9, further comprising a dark material disposed above the light source.